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LM3S812-EQN50-C2T

Texas Instruments

LM3S812-EQN50-C2T by Texas Instruments

Texas Instruments LM3S812-EQN50-C2T is a 32-bit microcontroller with 65536 ROM words, 8192 RAM bytes, and 34 I/O lines. Operating at up to 8 MHz, it is ideal for industrial applications requiring a max supply voltage of 3.6 V and operating temperature range from -40°C to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,340 parts In-Stock

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6,340

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Digiode

USA . 408 parts In-Stock

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408

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Distributors (Availability)

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AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$16.226

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-

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226

$16.226

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One Stop Electronics

USA . 1,568 parts In-Stock

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$18.000

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1,568

$18.000

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Parana Technologies

USA . 278 parts In-Stock

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$36.857

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278

$36.857

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ChromeModa Solutions

Germany . 1,200 parts In-Stock

1+ parts

$41.412

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$33.958

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1,200

$41.412

$33.958

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IDEA Electronic Components Group

UK . 57 parts In-Stock

1+ parts

$41.412

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$39.341

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$37.271

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57

$41.412

$39.341

$37.271

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DigiPath Technology Company

USA . 1,771 parts In-Stock

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$37.337

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1,771

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$37.337

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Corphita

USA . 1,182 parts In-Stock

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Microchip USA

USA . 129 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S812-EQN50-C2T microcontroller by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device offers unmatched quality and performance for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller provides seamless integration and advanced functionality, allowing you to bring your projects to life with ease. Trust Texas Instruments to deliver exceptional value and superior technology, making the LM3S812-EQN50-C2T the perfect choice for your next groundbreaking solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, providing flexibility in power requirements.

Bit Size: 32

Offers high computational capabilities and processing power.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

ROM Words: 65536

Ample memory for storing program instructions and data.

RAM Bytes: 8192

Sufficient random access memory for temporary data storage during operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture delivers efficient and high-performance operation for various applications.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the device without requiring specialized equipment.

Technical Specifications

Microcontrollers LM3S812-EQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S812-EQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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