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LM3S811-EQN50-C2T

Texas Instruments

LM3S811-EQN50-C2T by Texas Instruments

LM3S811-EQN50-C2T by Texas Instruments is a 32-bit microcontroller with 65536 ROM words and 8192 RAM bytes. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control. With features like PWM channels and ADC channels, this microcontroller is ideal for tasks that demand precise analog signal processing and pulse-width modulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,976 parts In-Stock

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5,976

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Digiode

USA . 2,536 parts In-Stock

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2,536

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Distributors (Availability)

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AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$13.615

100+ parts

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361

$13.615

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One Stop Electronics

USA . 829 parts In-Stock

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$19.000

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829

$19.000

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Parana Technologies

USA . 290 parts In-Stock

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$72.648

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290

$72.648

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DigiPath Technology Company

USA . 939 parts In-Stock

1+ parts

$79.994

100+ parts

$73.595

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939

$79.994

$73.595

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ChromeModa Solutions

Germany . 4,520 parts In-Stock

1+ parts

$81.627

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$66.934

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4,520

$81.627

$66.934

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$81.627

100+ parts

$77.546

1k+ parts

$73.464

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1,748

$81.627

$77.546

$73.464

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Corphita

USA . 624 parts In-Stock

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Microchip USA

USA . 239 parts In-Stock

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Overview

Experience the next level of performance with the LM3S811-EQN50-C2T microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This powerful 32-bit microcontroller is designed for a wide range of applications, offering customers exceptional value and benefits. From industrial automation to consumer electronics, this versatile device provides superior functionality and efficiency. Upgrade your project with the LM3S811-EQN50-C2T and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for improved portability and longevity of the product.

Surface Mount: YES

Easy to mount on circuit boards, saving space and making manufacturing processes efficient.

Maximum Supply Voltage: 3.6 V

Supports higher voltage applications without risking damage to the microcontroller.

Bit Size: 32

Higher bit size indicates better processing capabilities and performance.

Power Supplies (V): 3.3

Compatible with standard power supplies, making it easy to integrate into various systems.

No. of Terminals: 48

Sufficient number of terminals for connecting to external devices and peripherals.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing and response times.

RAM Bytes: 8192

Adequate RAM size for storing and manipulating data during operation.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high integration density.

Maximum Supply Current: 110 mA

Efficient power usage with low supply current requirement.

PWM Channels: YES

Pulse Width Modulation (PWM) support for precise control of connected devices.

Technical Specifications

Microcontrollers LM3S811-EQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S811-EQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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