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LM3S811-EQN50-C2

Texas Instruments

LM3S811-EQN50-C2 by Texas Instruments

LM3S811-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a RISC-based microcontroller with PWM channels and ADC capabilities.

Median Price

$48.938

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$48.938

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76

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Vyrian

USA . 5,329 parts In-Stock

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5,329

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Digiode

USA . 424 parts In-Stock

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424

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One Stop Electronics

USA . 1,576 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 481 parts In-Stock

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$16.967

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481

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Parana Technologies

USA . 1,407 parts In-Stock

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$58.081

100+ parts

$5,393.739

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$52.273

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1,407

$58.081

$5,393.739

$52.273

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DigiPath Technology Company

USA . 894 parts In-Stock

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$63.955

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894

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IDEA Electronic Components Group

UK . 1,602 parts In-Stock

1+ parts

$65.260

100+ parts

$61.997

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$58.734

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1,602

$65.260

$61.997

$58.734

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ChromeModa Solutions

Germany . 1,398 parts In-Stock

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$65.260

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$53.513

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Corphita

USA . 2,510 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your electronic projects with the LM3S811-EQN50-C2 microcontroller from Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance and reliability. This microcontroller is versatile and can be used in a wide range of applications, making it perfect for hobbyists and professionals alike. With its advanced features and ease of use, the LM3S811-EQN50-C2 offers exceptional value and benefits to customers looking to take their projects to the next level. Upgrade your designs today with this powerful and efficient microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Provides a wide operating range, allowing for flexibility in power supply options.

Bit Size: 32

Offers a high level of data processing capability, suitable for complex tasks and applications.

Power Supplies (V): 3.3

A common and stable voltage that is widely available, ensuring compatibility with various systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Compact form factor that saves space on the circuit board, suitable for compact or size-constrained designs.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial or harsh environments.

Minimum Operating Temperature: -40 °C

Operates reliably in cold conditions, suitable for a wide range of environments.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling interfacing with sensors and other analog devices.

ROM Words: 65536

Offers ample storage for program code and data, suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, suitable for demanding applications.

RAM Bytes: 8192

Provides sufficient memory for data storage and processing, supporting multitasking and complex algorithms.

Technology: CMOS

Low power consumption and high noise immunity, making it energy-efficient and reliable.

Maximum Clock Frequency: 0.032 MHz

Offers high-speed processing capability, suitable for real-time applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature and humidity levels.

PWM Channels: YES

Allows for pulse-width modulation, useful for controlling motors, LEDs, and other devices.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the device, enabling firmware updates and customization.

No. of I/O Lines: 32

Provides ample input/output options for connecting external devices and peripherals.

Technical Specifications

Microcontrollers LM3S811-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S811-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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