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LM3S801-EGZ50-C2

Texas Instruments

LM3S801-EGZ50-C2 by Texas Instruments

LM3S801-EGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a RISC-based microcontroller with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,232 parts In-Stock

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Digiode

USA . 3,782 parts In-Stock

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3,782

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,352 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 302 parts In-Stock

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$16.309

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Parana Technologies

USA . 574 parts In-Stock

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$27.580

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$37.600

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574

$27.580

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IDEA Electronic Components Group

UK . 846 parts In-Stock

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$30.989

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$29.440

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$27.890

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846

$30.989

$29.440

$27.890

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ChromeModa Solutions

Germany . 496 parts In-Stock

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$30.989

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$25.411

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496

$30.989

$25.411

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One Stop Electronics

USA . 1,000 parts In-Stock

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$35.000

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$35.000

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Corphita

USA . 4,338 parts In-Stock

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Microchip USA

USA . 2,351 parts In-Stock

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DigiPath Technology Company

USA . 1,918 parts In-Stock

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$27.940

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S801-EGZ50-C2 microcontroller. Perfect for a wide range of applications, this chip boasts impressive performance and reliability. With features like high-speed processing, low power consumption, and versatile I/O capabilities, this microcontroller offers unmatched value to customers looking to innovate in fields such as automation, IoT, robotics, and more. Trust in Texas Instruments to deliver quality products that push the boundaries of what's possible.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to mount the microcontroller on PCBs, allowing for compact and efficient designs.

Maximum Supply Voltage: 3.6 V

Can operate effectively with a supply voltage of up to 3.6V, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for easy placement and orientation on the PCB, simplifying assembly.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and processing tasks efficiently.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, making it compatible with a wide range of power sources.

No. of Terminals: 48

The high number of terminals allows for more I/O options and connectivity, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and robustness to the microcontroller, ensuring reliability in various applications.

Minimum Supply Voltage: 3 V

Can operate at a minimum supply voltage of 3V, ensuring stability and performance even under low-power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for reliable operation in challenging environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in extreme cold conditions, making it suitable for a variety of applications.

ADC Channels: YES

Built-in ADC channels enable analog input processing, expanding the range of sensors and devices that can be interfaced with the microcontroller.

Terminal Position: QUAD

Quad terminal position enhances accessibility and ease of connection, simplifying the integration of the microcontroller into the system.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data, enabling complex applications to be implemented effectively.

Maximum Seated Height: 1 mm

Low seated height makes the microcontroller suitable for slim and compact designs, saving space in the overall system layout.

Width: 6.875 mm

Compact width dimension allows for efficient utilization of space on the PCB, enabling more functionality in a limited footprint.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency enables fast processing speed, enhancing the overall performance of the microcontroller.

Length: 6.875 mm

Optimal length dimension ensures a balanced form factor, making it easy to integrate the microcontroller into various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and durability in harsh industrial environments, making it a robust choice for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enhances processing efficiency, reducing power consumption and improving performance.

RAM Bytes: 8192

Generous RAM capacity allows for efficient data storage and processing, enabling faster operation and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and assembly processes, improving reliability and reducing manufacturing costs.

Maximum Supply Current: 110 mA

Moderate maximum supply current ensures efficient power utilization, prolonging battery life in portable devices and reducing heat dissipation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources, simplifying system design.

PWM Channels: YES

Built-in PWM channels enable precise control of analog outputs, making the microcontroller suitable for applications requiring accurate voltage or current modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates, enhancing flexibility and future-proofing the microcontroller for evolving requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting on the PCB, maximizing I/O capabilities and minimizing space requirements.

Speed: 50 rpm

Operates at a speed of 50 rpm, providing fast data processing and response times for time-sensitive applications.

No. of I/O Lines: 36

Abundance of I/O lines allows for versatile interfacing with external devices and components, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers LM3S801-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S801-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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