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LM3S800-IQN50-C2T

Texas Instruments

LM3S800-IQN50-C2T by Texas Instruments

LM3S800-IQN50-C2T by Texas Instruments is a 32-bit microcontroller with 8192 bytes of RAM and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power mode and connectivity via I2C, SSI, and UART interfaces. With integrated cache and peripherals like timers and PWM channels, it offers efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,842 parts In-Stock

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Digiode

USA . 1,807 parts In-Stock

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1,807

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Distributors (Availability)

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$14.264

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404

$14.264

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One Stop Electronics

USA . 1,230 parts In-Stock

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$15.000

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$15.000

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Microchip USA

USA . 3,778 parts In-Stock

1+ parts

$21.120

100+ parts

$20.820

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$20.660

10k+ parts

$20.510

3,778

$21.120

$20.820

$20.660

$20.510

Parana Technologies

USA . 322 parts In-Stock

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$65.670

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322

$65.670

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DigiPath Technology Company

USA . 307 parts In-Stock

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$72.311

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$66.526

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307

$72.311

$66.526

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IDEA Electronic Components Group

UK . 274 parts In-Stock

1+ parts

$73.787

100+ parts

$70.098

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$66.408

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274

$73.787

$70.098

$66.408

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ChromeModa Solutions

Germany . 134 parts In-Stock

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$73.787

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$60.505

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134

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Component Stockers USA

USA . 357 parts In-Stock

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$99.990

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357

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Corphita

USA . 1,209 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the LM3S800-IQN50-C2T microcontroller by Texas Instruments. Crafted with precision and expertise, this versatile device offers a wide array of applications in various industries. From automation to IoT, this powerful Cortex-M3 processor delivers unmatched performance and reliability. Experience seamless connectivity with integrated peripherals and low power modes, ensuring efficiency and functionality. Elevate your designs with Texas Instruments' cutting-edge technology and unlock endless possibilities with the LM3S800-IQN50-C2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package durable and resistant to impact, making it suitable for various applications.

Integrated Cache: YES

Integrated cache improves the performance of the microcontroller by reducing access times to frequently used data, enhancing overall system speed.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options and compatibility with a range of external components.

On Chip Data RAM Width: 8 bits

Wide on-chip data RAM width allows for efficient data processing and storage, enhancing the microcontroller's performance.

Package Shape: SQUARE

Square package shape facilitates easier mounting and alignment on circuit boards, ensuring proper connection and integration.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex calculations and data manipulation tasks with high precision and efficiency.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation and performance of the microcontroller in various conditions.

No. of Terminals: 48

High number of terminals allows for more input/output connections, enabling the microcontroller to interface with multiple external devices.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact form factor and easy mounting options, making it suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures the microcontroller can operate efficiently in low-power applications or when power supply fluctuates.

Maximum Operating Temperature: 85°C

High maximum operating temperature range allows the microcontroller to be used in industrial environments without the risk of overheating.

CPU Family: CORTEX-M3

Cortex-M3 architecture provides high performance and low power consumption, making it well-suited for embedded systems and IoT applications.

Minimum Operating Temperature: -40°C

Wide operating temperature range enables the microcontroller to function reliably in extreme environmental conditions, such as cold temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance, maintaining reliable connections over time.

Terminal Position: QUAD

Quad terminal position offers easier soldering and improves the mechanical strength of connections, enhancing the durability of the microcontroller.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing program instructions and data, enabling the microcontroller to support complex applications.

Maximum Seated Height: 1.6 mm

Low seated height enables the microcontroller to be used in slim devices or applications with height restrictions, maximizing design flexibility.

Width: 7 mm

Compact width of 7mm saves space on the circuit board, allowing for denser component placement and efficient use of available area.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during manufacturing, ensuring high quality and reliability of the final product.

Technical Specifications

Microcontrollers LM3S800-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

36

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Trade Compliance

LM3S800-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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