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LM3S6G65-IQC80-A2

Texas Instruments

LM3S6G65-IQC80-A2 by Texas Instruments

LM3S6G65-IQC80-A2 by Texas Instruments is a 32-bit microcontroller with 393216 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring high-speed processing. With features like ADC and DMA channels, it offers versatile functionality in a compact package style ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,645 parts In-Stock

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Digiode

USA . 1,040 parts In-Stock

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1,040

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Distributors (Availability)

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AZTECH Wire

Italy . 769 parts In-Stock

1+ parts

$6.599

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769

$6.599

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One Stop Electronics

USA . 1,512 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 672 parts In-Stock

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$18.432

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$18.552

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672

$18.432

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$18.552

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DigiPath Technology Company

USA . 880 parts In-Stock

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$20.296

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880

$20.296

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ChromeModa Solutions

Germany . 4,852 parts In-Stock

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$20.710

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$16.982

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4,852

$20.710

$16.982

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IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$20.710

100+ parts

$19.674

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$18.639

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916

$20.710

$19.674

$18.639

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Corphita

USA . 1,635 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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Overview

Discover the cutting-edge LM3S6G65-IQC80-A2 microcontroller by Texas Instruments, a powerhouse in the field of microcontrollers. This versatile device offers a wide range of applications and benefits, from its high-quality construction to its advanced features like ADC channels and PWM channels. Dive into the world of technology with this innovative product that is sure to elevate your projects to new heights. Trust in Texas Instruments for excellence in every aspect of your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.365 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving space on the PCB.

Bit Size: 32

32-bit architecture allows for higher processing capabilities and performance.

Power Supplies (V): 1.3,3.3

Support for multiple power supply voltages allows for flexibility in different applications.

No. of Terminals: 100

A high number of terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer versatility in mounting and integration into different systems.

Minimum Supply Voltage: 1.235 V

Low minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in industrial environments with varying temperature ranges.

CPU Family: CORTEX-M3

Cortex-M3 architecture offers high performance and efficiency in processing tasks.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable operation even in cold environments.

ADC Channels: YES

Built-in ADC channels enable analog input signal processing, expanding the microcontroller's capabilities.

DMA Channels: YES

DMA channels help in efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad-terminal position facilitates easy PCB layout and connections.

ROM Words: 393216

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low seated height enables a slim profile when mounted on the PCB.

Width: 14 mm

Compact width size saves space on the PCB and allows for dense PCB designs.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing and operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for 30 seconds ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable solder joints during assembly.

Length: 14 mm

Compact length size saves space on the PCB and allows for smaller form factor designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontroller architecture provides efficient and optimized processing capabilities for various applications.

RAM Bytes: 65536

Large RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable electrical connections.

Maximum Supply Current: 210 mA

Low maximum supply current requirement helps in reducing power consumption and heat dissipation.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Built-in PWM channels enable precise control of output signals, ideal for applications like motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of program code without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high interconnect density, allowing for more terminals in a compact package.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 80 rpm

Operating speed of 80 rpm ensures fast data processing and response times in various applications.

No. of I/O Lines: 46

Abundant I/O lines provide flexibility in interfacing with external devices and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM3S6G65-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6G65-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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