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LM3S6G11-IQC80-A1T

Texas Instruments

LM3S6G11-IQC80-A1T by Texas Instruments

LM3S6G11-IQC80-A1T by Texas Instruments is a 32-bit microcontroller with 393216 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it ideal for industrial applications requiring high-speed processing and control capabilities. With features like ADC and DMA channels, this microcontroller offers versatile functionality for various embedded systems projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,281 parts In-Stock

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Digiode

USA . 3,568 parts In-Stock

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3,568

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Distributors (Availability)

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AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$11.950

100+ parts

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670

$11.950

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One Stop Electronics

USA . 1,420 parts In-Stock

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$15.000

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1,420

$15.000

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Parana Technologies

USA . 1,760 parts In-Stock

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$44.794

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1,760

$44.794

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DigiPath Technology Company

USA . 176 parts In-Stock

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$49.323

100+ parts

$45.378

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176

$49.323

$45.378

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ChromeModa Solutions

Germany . 3,374 parts In-Stock

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$50.330

100+ parts

$41.271

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3,374

$50.330

$41.271

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IDEA Electronic Components Group

UK . 1,403 parts In-Stock

1+ parts

$50.330

100+ parts

$47.814

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$45.297

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1,403

$50.330

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$45.297

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Corphita

USA . 4,628 parts In-Stock

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Microchip USA

USA . 2,689 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S6G11-IQC80-A1T by Texas Instruments, a cutting-edge microcontroller that promises top-notch performance and reliability. Crafted by a renowned manufacturer, this device is designed to meet the demands of various applications with ease. From industrial automation to consumer electronics, this microcontroller offers unmatched value and benefits to customers looking for seamless operation and advanced features. Elevate your projects with the LM3S6G11-IQC80-A1T and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable and long-lasting applications.

Surface Mount: YES

Easy to integrate onto PCBs, saving assembly time and space.

Maximum Supply Voltage: 3.6 V

Wide voltage range allows for flexibility in power supply options.

Package Shape: SQUARE

Efficient use of space on the PCB, maximizing component density.

Bit Size: 32

High processing capability for complex tasks and algorithms.

Power Supplies (V): 1.3,3.3

Support for multiple power supply options, ensuring compatibility with various systems.

No. of Terminals: 100

Plenty of connectivity options for interfacing with external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles for different PCB design requirements.

Minimum Supply Voltage: 3 V

Reliable operation at low voltage levels, extending battery life.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial applications with high temperature requirements.

CPU Family: CORTEX-M3

Modern and efficient CPU architecture for high performance computing.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, suitable for outdoor and automotive applications.

ADC Channels: YES

Integrated analog-to-digital converters for sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access support for efficient data transfer and processing.

Terminal Position: QUAD

Quad position terminals for stable and secure connections on the PCB.

ROM Words: 393216

Large ROM capacity for storing program code and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim electronic devices.

Width: 14 mm

Compact form factor for space-constrained applications.

Maximum Clock Frequency: 16.384 MHz

High clock speed for fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Resistant to high temperature reflow soldering process, ensuring reliability during assembly.

Peak Reflow Temperature °C: 260

Compatible with lead-free soldering processes for environmental compliance.

Length: 14 mm

Compact size for fitting into small electronic devices.

Temperature Grade: INDUSTRIAL

Designed for use in industrial environments with robust temperature requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced RISC architecture for efficient and responsive control tasks.

RAM Bytes: 65536

Sufficient RAM capacity for data storage and manipulation during operation.

Technology: CMOS

CMOS technology for low power consumption and reliable performance.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and secure PCB mounting.

Maximum Supply Current: 210 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for reliable and consistent performance.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM for easy programmability and firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layout with reduced space between connections.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant packaging for increased reliability in humid environments.

Speed: 80 rpm

High processing speed for quick response times in real-time applications.

No. of I/O Lines: 46

Sufficient I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6G11-IQC80-A1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6G11-IQC80-A1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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