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LM3S6952-EQC50-A2T

Texas Instruments

LM3S6952-EQC50-A2T by Texas Instruments

LM3S6952-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and ADC channels for analog signal conversion. The compact square package with gull wing terminals makes it ideal for space-constrained designs in various electronic devices.

Median Price

$85.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$85.660

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84

$85.660

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Vyrian

USA . 2,783 parts In-Stock

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2,783

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Digiode

USA . 759 parts In-Stock

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759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,539 parts In-Stock

1+ parts

$11.000

100+ parts

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1,539

$11.000

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$14.601

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437

$14.601

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Parana Technologies

USA . 2,323 parts In-Stock

1+ parts

$38.473

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2,323

$38.473

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DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

$42.363

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910

$42.363

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ChromeModa Solutions

Germany . 3,994 parts In-Stock

1+ parts

$43.228

100+ parts

$35.447

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3,994

$43.228

$35.447

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

1+ parts

$43.228

100+ parts

$41.067

1k+ parts

$38.905

10k+ parts

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1,112

$43.228

$41.067

$38.905

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Corphita

USA . 4,410 parts In-Stock

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4,410

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Microchip USA

USA . 4,010 parts In-Stock

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4,010

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Overview

Unlock the power of innovation with the Texas Instruments LM3S6952-EQC50-A2T microcontroller. This cutting-edge device offers unmatched quality and reliability, thanks to its industry-leading manufacturer. Ideal for a wide range of applications, this microcontroller provides unparalleled value and benefits to customers looking to streamline their processes and boost efficiency. Experience next-level performance and seamless integration with the LM3S6952-EQC50-A2T from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable, ensuring the longevity and stability of the microcontroller.

Surface Mount: YES

Surface mount packaging makes it easy to integrate the microcontroller onto a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

With a moderate maximum supply voltage, this microcontroller is suitable for low power applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on a PCB board.

Bit Size: 32

32-bit architecture allows for complex calculations and processing capabilities.

Power Supplies (V): 2.5,3.3

Multiple power supply options provide flexibility in design and compatibility with different systems.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and interfaces, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK

Flatpack style enhances thermal dissipation and allows for efficient heat management.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage enables operation in low power or battery-operated devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes this microcontroller suitable for industrial environments.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position allows for easy connections and soldering onto a circuit board.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low profile height is ideal for applications where space is limited.

Width: 14 mm

Compact width makes this microcontroller suitable for small form factor devices.

Maximum Clock Frequency: 8.192 MHz

High clock frequency enables fast processing and execution of instructions.

Length: 14 mm

Short length allows for easy integration into compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, making it suitable for rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and high-performance computing capabilities for the microcontroller.

RAM Bytes: 65536

Large RAM capacity enables the microcontroller to store and access a substantial amount of data during operation.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals and outputs.

ROM Programmability: FLASH

Flash ROM technology allows for easy reprogramming of the microcontroller's memory.

Terminal Pitch: 0.5 mm

Narrow terminal pitch facilitates high-density mounting on a circuit board.

Speed: 50 rpm

Operates effectively at a speed of 50 rpm, suitable for a wide range of applications.

No. of I/O Lines: 43

Having 43 I/O lines provides ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6952-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6952-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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