Loading...

LM3S6950-IBZ50-A2T

Texas Instruments

LM3S6950-IBZ50-A2T by Texas Instruments

LM3S6950-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,404

-

-

-

-

Digiode

USA . 3,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,614

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$6.644

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$6.644

-

-

-

One Stop Electronics

USA . 1,267 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,267

$18.000

-

-

-

Parana Technologies

USA . 961 parts In-Stock

1+ parts

$63.860

100+ parts

-

1k+ parts

-

10k+ parts

-

961

$63.860

-

-

-

DigiPath Technology Company

USA . 1,274 parts In-Stock

1+ parts

$70.318

100+ parts

$64.693

1k+ parts

-

10k+ parts

-

1,274

$70.318

$64.693

-

-

ChromeModa Solutions

Germany . 2,090 parts In-Stock

1+ parts

$71.753

100+ parts

$58.837

1k+ parts

-

10k+ parts

-

2,090

$71.753

$58.837

-

-

IDEA Electronic Components Group

UK . 473 parts In-Stock

1+ parts

$71.753

100+ parts

$68.165

1k+ parts

$64.578

10k+ parts

-

473

$71.753

$68.165

$64.578

-

Component Stockers USA

USA . 619 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

619

$99.990

-

-

-

Corphita

USA . 3,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,239

-

-

-

-

Microchip USA

USA . 137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

137

-

-

-

-

Overview

Unlock the power of innovation with Texas Instruments' LM3S6950-IBZ50-A2T microcontroller. This high-quality device offers unmatched reliability and performance, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers value, benefits, and advantages that exceed expectations. Trust in Texas Instruments to provide cutting-edge technology that pushes the boundaries of what's possible. Experience the difference with the LM3S6950-IBZ50-A2T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, reducing energy consumption and heat generation.

Package Shape: SQUARE

Saves space on the PCB, allowing for compact and efficient designs.

Bit Size: 32

Provides a balance of performance and power efficiency for various applications.

Power Supplies (V): 2.5, 3.3

Compatible with common voltage standards, making integration easier with existing systems.

No. of Terminals: 108

Offers a wide range of connectivity options for peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY

Enhances thermal dissipation and mechanical stability, improving overall reliability.

Minimum Supply Voltage: 2.25 V

Provides flexibility in power supply requirements, accommodating different voltage levels.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges, ensuring reliable performance under stress.

Minimum Operating Temperature: -40 °C

Can withstand harsh operating conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for reliable electrical connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog devices.

Terminal Position: BOTTOM

Facilitates easier PCB layout and routing, optimizing space utilization.

ROM Words: 262144

Provides ample storage capacity for program memory, allowing for complex applications to be implemented.

Maximum Seated Height: 1.5 mm

Low profile design saves space in compact electronic devices.

Width: 10 mm

Compact form factor for integration into tight spaces or small PCB designs.

Maximum Clock Frequency: 8.192 MHz

Offers high processing speed for quick execution of tasks in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Facilitates easy and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperature soldering processes, ensuring robust solder joints.

Length: 10 mm

Compact form factor for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature and humidity conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing architecture for efficient and fast processing.

RAM Bytes: 65536

Offers a substantial amount of random access memory for data storage and processing.

Technology: CMOS

Complementary metal-oxide-semiconductor technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball grid array terminals for reliable and efficient electrical connections.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for stable and efficient operation of the microcontroller.

PWM Channels: YES

Supports pulse width modulation for precise control of motors, LEDs, and other devices.

ROM Programmability: FLASH

Flash memory allows for easy and quick reprogramming of the ROM, facilitating firmware updates and modifications.

Terminal Pitch: 0.8 mm

Fine pitch terminals for high-density interconnection and compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with a moderate level of moisture sensitivity.

Speed: 50 rpm

Capable of processing tasks at a speed of 50 rotations per minute, suitable for various applications.

No. of I/O Lines: 46

Provides a sufficient number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6950-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6950-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20