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LM3S6950-EQC50-A2T

Texas Instruments

LM3S6950-EQC50-A2T by Texas Instruments

LM3S6950-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,875 parts In-Stock

1+ parts

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3,875

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Digiode

USA . 681 parts In-Stock

1+ parts

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681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 970 parts In-Stock

1+ parts

$11.000

100+ parts

-

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970

$11.000

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AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$12.360

100+ parts

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634

$12.360

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Parana Technologies

USA . 1,287 parts In-Stock

1+ parts

$63.056

100+ parts

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1,287

$63.056

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ChromeModa Solutions

Germany . 5,360 parts In-Stock

1+ parts

$70.850

100+ parts

$58.097

1k+ parts

-

10k+ parts

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5,360

$70.850

$58.097

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

1+ parts

$70.850

100+ parts

$67.308

1k+ parts

$63.765

10k+ parts

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2,244

$70.850

$67.308

$63.765

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Microchip USA

USA . 6,976 parts In-Stock

1+ parts

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6,976

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Corphita

USA . 2,552 parts In-Stock

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2,552

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DigiPath Technology Company

USA . 1,991 parts In-Stock

1+ parts

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100+ parts

$63.878

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1,991

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$63.878

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Overview

Unlock a world of possibilities with the LM3S6950-EQC50-A2T by Texas Instruments. This high-quality microcontroller offers unparalleled performance and reliability, thanks to the renowned manufacturer's expertise in the field. Ideal for a wide range of applications, this product provides exceptional value to customers seeking efficiency, flexibility, and innovation in their projects. Say hello to a new era of technology with the LM3S6950-EQC50-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and facilitating mass production.

Maximum Supply Voltage: 2.75 V

Ensures compatibility with low voltage systems, extending the range of applications for the microcontroller.

Package Shape: SQUARE

Allows for efficient use of space on the PCB and facilitates easy mounting and alignment.

Bit Size: 32

Offers high computational power and precision for processing complex algorithms and tasks.

Power Supplies (V): 2.5,3.3

Provides flexibility in power options, enabling compatibility with a wide range of systems and devices.

No. of Terminals: 100

Offers numerous connection points for interfacing with external components and peripherals, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK

Features a low profile design that enhances thermal performance and allows for easy installation in space-constrained environments.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even in low voltage conditions, making the microcontroller suitable for power-sensitive applications.

Maximum Operating Temperature: 105 °C

Allows the microcontroller to withstand high operating temperatures, ensuring stability and performance in harsh environments.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extreme cold temperatures, expanding the range of applications for the microcontroller.

ADC Channels: YES

Enables analog-to-digital conversion, facilitating sensor interfacing and data acquisition in various applications.

Terminal Position: QUAD

Organizes terminals into four groups for efficient connectivity and PCB layout, streamlining the integration process.

ROM Words: 262144

Offers ample memory capacity for storing program instructions and data, supporting complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Features a compact form factor for space-constrained designs, allowing for easy placement in compact devices.

Width: 14 mm

Provides a compact footprint for the microcontroller, enabling it to be used in small form factor applications.

Maximum Clock Frequency: 8.192 MHz

Delivers high-speed processing capabilities, supporting real-time applications and demanding tasks.

Length: 14 mm

Offers a square form factor for balanced dimensions, making it easy to integrate into various PCB layouts.

Temperature Grade: INDUSTRIAL

Certified for industrial use, ensuring reliable operation in rugged environments and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Incorporates a RISC architecture for efficient data processing and control, enhancing the microcontroller's performance.

RAM Bytes: 65536

Provides ample volatile memory for storing data and variables during program execution, supporting multitasking and data-intensive operations.

Technology: CMOS

Employs CMOS technology for low power consumption and high noise immunity, maximizing efficiency and reliability.

Terminal Form: GULL WING

Features gull wing terminals for easy soldering and robust mechanical connections, ensuring secure PCB mounting.

Nominal Supply Voltage: 2.5 V

Specifies the standard operating voltage for stable performance and compatibility with most systems and components.

PWM Channels: YES

Supports pulse-width modulation for precise control of motor speed, LED brightness, and other applications requiring variable output signals.

ROM Programmability: FLASH

Utilizes flash memory for reprogrammable storage, allowing for firmware updates and customization without replacing the microcontroller.

Terminal Pitch: 0.5 mm

Specifies the pitch between terminals for compact PCB layout and easy routing of signal traces, enhancing design flexibility.

Speed: 50 rpm

Indicates the rotational speed for motor control applications, enabling precise speed regulation and motion control.

No. of I/O Lines: 46

Provides numerous input/output lines for interfacing with external devices and peripherals, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers LM3S6950-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6950-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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