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LM3S6950-EQC50-A2

Texas Instruments

LM3S6950-EQC50-A2 by Texas Instruments

LM3S6950-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates b/w -40 to 105°C, has a max clock frequency of 8.192 MHz, and offers PWM channels for industrial applications requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,938 parts In-Stock

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Digiode

USA . 3,537 parts In-Stock

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3,537

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Distributors (Availability)

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AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$6.399

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779

$6.399

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One Stop Electronics

USA . 1,591 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 1,930 parts In-Stock

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$70.438

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1,930

$70.438

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DigiPath Technology Company

USA . 1,108 parts In-Stock

1+ parts

$77.561

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$71.356

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1,108

$77.561

$71.356

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ChromeModa Solutions

Germany . 3,603 parts In-Stock

1+ parts

$79.144

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$64.898

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3,603

$79.144

$64.898

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$79.144

100+ parts

$75.187

1k+ parts

$71.230

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1,139

$79.144

$75.187

$71.230

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Corphita

USA . 1,360 parts In-Stock

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Microchip USA

USA . 304 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S6950-EQC50-A2 by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise by a renowned manufacturer, this high-quality device offers unparalleled performance and reliability for a wide range of applications. With its advanced features and impressive capabilities, the LM3S6950-EQC50-A2 delivers exceptional value and benefits to customers seeking top-notch solutions in the realm of technology. Upgrade your creations today and experience the advantages of this state-of-the-art microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring longevity and reliability in various environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing manufacturing time and cost.

Maximum Supply Voltage: 2.75 V

Provides flexibility in power input options while ensuring safe operation within the specified voltage range.

Package Shape: SQUARE

A compact and symmetrical shape that facilitates efficient PCB layout and space utilization.

Bit Size: 32

Offers high processing capability and performance for various applications.

Power Supplies (V): 2.5, 3.3

Supports multiple voltage options for compatibility with different systems and peripherals.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other devices and components.

Package Style (Meter): FLATPACK

Ensures a low-profile design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even at lower voltage levels, improving energy efficiency.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where high temperatures are common, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold conditions, making the microcontroller versatile for various environments.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with analog sensors and inputs.

Terminal Position: QUAD

Facilitates easy PCB routing and design, optimizing signal integrity and performance.

ROM Words: 262144

Provides ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for thin and compact applications.

Width: 14 mm

Compact size for space-constrained designs.

Maximum Clock Frequency: 8.192 MHz

High clock frequency for fast processing and response times.

Length: 14 mm

Compact size for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient instruction execution and improved performance.

RAM Bytes: 65536

Provides ample memory for temporary data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Standard voltage supply for compatibility with various systems and components.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of output signals, ideal for motor control and power regulation.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB designs and improved signal integrity.

Speed: 50 rpm

Capable of high-speed processing for real-time applications and rapid data processing.

No. of I/O Lines: 46

Offers a sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6950-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6950-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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