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LM3S6911-IQC50-A2

Texas Instruments

LM3S6911-IQC50-A2 by Texas Instruments

Texas Instruments LM3S6911-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 65536 bytes RAM, and 262144 ROM words. Ideal for industrial applications, it offers Ethernet connectivity, 4 timers, and low power mode with a max clock frequency of 50 MHz.

Median Price

$42.960

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Chip1Stop

Japan . 16 parts In-Stock

1+ parts

$39.640

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$39.640

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Arrow

USA . 6 parts In-Stock

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$42.960

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$34.540

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$42.960

$34.540

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Verical

USA . 6 parts In-Stock

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$42.960

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$34.540

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6

$42.960

$34.540

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DigiKey

USA . 41 parts In-Stock

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$53.270

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$39.020

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41

$53.270

$39.020

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Distributors (In-Stock)

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Nova Conductors

Japan . 67 parts In-Stock

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$33.102

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Digiode

USA . 3,188 parts In-Stock

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$34.884

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Vyrian

USA . 5,195 parts In-Stock

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Chip Stock

USA . 2,689 parts In-Stock

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2,689

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TME

Poland . 90 parts In-Stock

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$45.940

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$45.940

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Cyclops Electronics Ltd

UK . 9 parts In-Stock

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9

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Connector Distribution Corp

USA . 1 parts In-Stock

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Right Parts Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 519 parts In-Stock

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$8.571

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519

$8.571

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Parana Technologies

USA . 144 parts In-Stock

1+ parts

$16.663

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$1,547.456

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$14.997

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144

$16.663

$1,547.456

$14.997

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DigiPath Technology Company

USA . 76 parts In-Stock

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$18.349

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$18.349

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ChromeModa Solutions

Germany . 2,411 parts In-Stock

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$18.723

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$15.353

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$18.723

$15.353

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$18.723

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$17.787

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$16.851

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141

$18.723

$17.787

$16.851

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Ampacity Inc.

Singapore . 102 parts In-Stock

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$31.210

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Corphita

USA . 845 parts In-Stock

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$33.048

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Continental Prestige Electronics

USA . 4,623 parts In-Stock

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$33.102

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$32.440

4,623

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Netroflash

USA . 2,000 parts In-Stock

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$33.102

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$32.440

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$31.447

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$30.785

2,000

$33.102

$32.440

$31.447

$30.785

Microchip USA

USA . 1,126 parts In-Stock

1+ parts

$91.770

100+ parts

$90.170

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$89.380

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$88.580

1,126

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$90.170

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$88.580

Lixinc

USA . 4,982 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 1,782 parts In-Stock

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Kepictronics

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Overview

Unlock the potential of your projects with the LM3S6911-IQC50-A2 microcontroller from Texas Instruments. Crafted with precision and top-notch quality, this device offers unmatched reliability and performance. Ideal for a wide range of applications, this microcontroller is designed to meet the needs of industrial settings with its industrial-grade temperature range. With advanced features like integrated cache and low power mode, you can trust this microcontroller to deliver exceptional results while ensuring energy efficiency. Say goodbye to limitations and hello to endless possibilities with the LM3S6911-IQC50-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring its longevity and reliability in various operating conditions.

Integrated Cache: YES

The integrated cache helps in storing frequently accessed data which speeds up processing and enhances overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for better efficiency and performance of the microcontroller in demanding applications.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 family means the microcontroller has a powerful and efficient architecture suitable for a wide range of applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient updates to the firmware of the microcontroller without the need for specialized equipment.

Connectivity: ETHERNET, I2C(2), SSI(2), UART(3)

The multiple connectivity options enable seamless communication with other devices, making the microcontroller versatile and adaptable for various interfaces.

RAM Bytes: 65536

With a large RAM capacity, the microcontroller can handle complex tasks and store a significant amount of data for efficient processing.

Maximum Clock Frequency: 50 MHz

The high clock frequency allows for quick execution of instructions, providing fast response times and enhanced performance in real-time applications.

Technical Specifications

Microcontrollers LM3S6911-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

41

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S6911-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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