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LM3S6911-IBZ50-A2T

Texas Instruments

LM3S6911-IBZ50-A2T by Texas Instruments

LM3S6911-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with integrated cache and 262144 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power mode and connectivity via Ethernet, I2C, SSI, and UART interfaces. With 46 I/O lines and 8 serial I/Os, it offers versatile peripheral options for various embedded systems.

Median Price

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1k+

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Vyrian

USA . 8,312 parts In-Stock

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Digiode

USA . 2,259 parts In-Stock

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AZTECH Wire

Italy . 292 parts In-Stock

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$12.065

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Parana Technologies

USA . 1,815 parts In-Stock

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$17.547

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$17.741

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One Stop Electronics

USA . 1,121 parts In-Stock

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$18.000

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Ampacity Inc.

Singapore . 378 parts In-Stock

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$19.000

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DigiPath Technology Company

USA . 755 parts In-Stock

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$19.322

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ChromeModa Solutions

Germany . 5,336 parts In-Stock

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$19.716

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$16.167

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IDEA Electronic Components Group

UK . 1,027 parts In-Stock

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$19.716

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$18.730

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$17.744

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Component Stockers USA

USA . 216 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,843 parts In-Stock

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Corphita

USA . 2,815 parts In-Stock

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the LM3S6911-IBZ50-A2T microcontroller by Texas Instruments. This high-quality product offers unmatched performance and reliability, making it perfect for a wide range of applications. With integrated cache and low power mode, this microcontroller provides efficient operation and seamless connectivity. Trust in Texas Instruments' reputation for excellence and elevate your projects to new heights with the LM3S6911-IBZ50-A2T. Experience the value and benefits of this exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding extra weight.

Integrated Cache: YES

The integrated cache helps in improving the overall performance of the microcontroller by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to assemble on circuit boards, saving space and allowing for higher component density.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage specification ensures the safe operation of the microcontroller and prevents damage from overvoltage.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capabilities within the microcontroller.

Package Shape: SQUARE

The square package shape provides a uniform footprint for easy placement on circuit boards and efficient use of space.

Bit Size: 32

A 32-bit microcontroller offers higher computational capabilities and performance compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 2.5,3.3

Having multiple power supply options allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 108

The high number of terminals enables the microcontroller to interface with a wide range of external components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and reliability for the microcontroller.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage specification ensures that the microcontroller remains operational even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can function reliably in harsh environmental conditions without overheating.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures compatibility with a wide range of development tools and software, making it easier to program and integrate into projects.

Minimum Operating Temperature: -40 °C

The microcontroller can operate effectively even in extremely cold temperatures, expanding its usability in various applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and resistance to corrosion, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes it easier to solder the microcontroller onto PCBs and ensures a secure mechanical connection.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program data, enabling the microcontroller to run complex algorithms and applications.

Maximum Seated Height: 1.5 mm

The low seated height makes the microcontroller suitable for slim and compact device designs where space is limited.

Width: 10 mm

The compact width of the microcontroller makes it easy to accommodate in tight spaces and small electronic devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during the development and production stages.

Peripherals: TIMER(4), WDT

The presence of multiple timers and a watchdog timer enhances the microcontroller's functionality for time-sensitive applications and system monitoring.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency supports fast data processing and execution of instructions, contributing to the overall performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the microcontroller can withstand the reflow soldering process for a sufficient duration without being damaged.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows the microcontroller to endure the solder reflow process without compromising its functionality.

Length: 10 mm

The compact length of the microcontroller contributes to its space-saving design and makes it suitable for small form factor applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures the microcontroller's reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller utilizing RISC architecture provides efficient and faster processing of instructions, making it suitable for high-performance applications.

No. of Timers: 4

Having multiple timers allows the microcontroller to manage different timing operations simultaneously, enhancing its versatility and functionality.

RAM Bytes: 65536

The large RAM capacity provides ample space for temporary data storage and processing, supporting the microcontroller's performance in multitasking applications.

Technology: CMOS

CMOS technology enables low power consumption and high speed operation, making the microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form facilitates easy and reliable soldering onto PCBs, ensuring secure electrical connections for the microcontroller.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage specification indicates the standard operating voltage for the microcontroller, ensuring compatibility with common power sources.

No. of Serial I/Os: 8

Having multiple serial I/Os enables the microcontroller to communicate with other devices and peripherals, expanding its connectivity options.

PWM Channels: YES

Pulse Width Modulation (PWM) capability allows the microcontroller to control analog devices and perform precision tasks, enhancing its functionality in various applications.

Connectivity: ETHERNET, I2C(2), SSI(2), UART(3)

The microcontroller's connectivity options with Ethernet, I2C, SSI, and UART interfaces enable seamless communication with external devices, networking, and sensor integration.

ROM Programmability: FLASH

Programmable Flash memory enables the microcontroller to be reprogrammed multiple times, allowing for flexible software updates and customization.

Terminal Pitch: 0.8 mm

The small terminal pitch facilitates precise placement on PCBs and allows for high-density mounting of the microcontroller on compact electronic devices.

Format: FIXED POINT

Using a fixed-point format for data representation simplifies numerical calculations and increases computational efficiency in the microcontroller's operations.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the microcontroller's resistance to moisture during storage and handling, ensuring its reliability and longevity in various environments.

Speed: 50 rpm

With a speed rating of 50 revolutions per minute, the microcontroller can process instructions and data at a high rate, meeting the performance demands of the applications.

Low Power Mode: YES

The low power mode feature allows the microcontroller to reduce power consumption during idle or low activity periods, extending battery life in portable devices.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits enables efficient storage and retrieval of program instructions, contributing to the microcontroller's overall performance.

No. of I/O Lines: 46

Having a high number of I/O lines provides ample options for connecting external devices and peripherals, enhancing the microcontroller's interface capabilities.

Technical Specifications

Microcontrollers LM3S6911-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

46

No. of Serial I/Os:

8

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S6911-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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