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LM3S6911-IBZ50-A2

Texas Instruments

LM3S6911-IBZ50-A2 by Texas Instruments

Texas Instruments LM3S6911-IBZ50-A2 microcontroller features 32-bit Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications, it offers Ethernet connectivity, 4 timers, and low power mode for efficient operation at temperatures ranging from -40 to 85°C.

Median Price

$50.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7 parts In-Stock

1+ parts

$50.330

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7

$50.330

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Distributors (In-Stock)

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Digiode

USA . 1,808 parts In-Stock

1+ parts

$42.398

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1,808

$42.398

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Vyrian

USA . 5,043 parts In-Stock

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5,043

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Distributors (Availability)

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Corphita

USA . 3,207 parts In-Stock

1+ parts

$40.167

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3,207

$40.167

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Parana Technologies

USA . 1,219 parts In-Stock

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$40.475

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1,219

$40.475

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IDEA Electronic Components Group

UK . 1,721 parts In-Stock

1+ parts

$45.477

100+ parts

$43.203

1k+ parts

$40.929

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1,721

$45.477

$43.203

$40.929

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ChromeModa Solutions

Germany . 615 parts In-Stock

1+ parts

$45.477

100+ parts

$37.291

1k+ parts

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615

$45.477

$37.291

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Microchip USA

USA . 278 parts In-Stock

1+ parts

$101.640

100+ parts

$99.870

1k+ parts

$98.990

10k+ parts

$98.100

278

$101.640

$99.870

$98.990

$98.100

Glotronic Ltd.

UK . 9,000 parts In-Stock

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9,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 290 parts In-Stock

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$41.002

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290

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$41.002

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Overview

Unlock the power of cutting-edge technology with the LM3S6911-IBZ50-A2 microcontroller by Texas Instruments. Designed for industrial applications, this high-quality device boasts a wide range of peripherals including timers and watchdog timers, along with connectivity options like Ethernet and UART. With its low power mode and integrated cache, this microcontroller offers unmatched efficiency and performance. Trust in Texas Instruments' reputation for excellence and experience the seamless integration and innovative solutions that the LM3S6911-IBZ50-A2 provides. Elevate your projects to new heights with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications where weight and durability are important factors.

Integrated Cache: YES

The integrated cache helps in improving the processing speed by storing frequently used data and instructions, resulting in faster execution of tasks.

Maximum Supply Voltage: 2.75 V

The lower maximum supply voltage ensures efficient power consumption and reduces the risk of damage due to overvoltage, making it a reliable choice for power-sensitive applications.

Bit Size: 32

The 32-bit architecture allows for efficient handling of large amounts of data and complex calculations, making the microcontroller suitable for high-performance applications.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its low power consumption and high performance, making it ideal for embedded systems and IoT applications.

ROM Programmability: FLASH

The ability to programm the ROM using FLASH technology allows for easy and flexible updates to the firmware, enhancing the product's versatility and adaptability.

Technical Specifications

Microcontrollers LM3S6911-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

46

No. of Serial I/Os:

8

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S6911-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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