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LM3S6730-IBZ50-A2

Texas Instruments

LM3S6730-IBZ50-A2 by Texas Instruments

LM3S6730-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 85 °C, it offers versatile performance in various environments.

Median Price

$18.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$15.670

1k+ parts

$14.020

10k+ parts

$13.190

90

-

$15.670

$14.020

$13.190

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$20.610

1k+ parts

-

10k+ parts

-

90

-

$20.610

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 176 parts In-Stock

1+ parts

$16.530

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$16.530

-

-

-

Vyrian

USA . 9,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,348

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,370 parts In-Stock

1+ parts

$8.992

100+ parts

$8.903

1k+ parts

$8.543

10k+ parts

-

1,370

$8.992

$8.903

$8.543

-

Ampacity Inc.

Singapore . 56 parts In-Stock

1+ parts

$14.790

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$14.790

-

-

-

Corphita

USA . 106 parts In-Stock

1+ parts

$15.660

100+ parts

-

1k+ parts

-

10k+ parts

-

106

$15.660

-

-

-

Parana Technologies

USA . 1,058 parts In-Stock

1+ parts

$66.146

100+ parts

-

1k+ parts

-

10k+ parts

-

1,058

$66.146

-

-

-

ChromeModa Solutions

Germany . 3,299 parts In-Stock

1+ parts

$74.321

100+ parts

$60.943

1k+ parts

-

10k+ parts

-

3,299

$74.321

$60.943

-

-

IDEA Electronic Components Group

UK . 1,395 parts In-Stock

1+ parts

$74.321

100+ parts

$70.605

1k+ parts

$66.889

10k+ parts

-

1,395

$74.321

$70.605

$66.889

-

DigiPath Technology Company

USA . 1,308 parts In-Stock

1+ parts

-

100+ parts

$67.008

1k+ parts

-

10k+ parts

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1,308

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$67.008

-

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Microchip USA

USA . 458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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458

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S6730-IBZ50-A2 microcontroller, offering unparalleled quality and reliability. This versatile device is perfect for a wide range of applications, providing customers with seamless performance and efficiency. With features like high-speed processing, ample memory capacity, and a compact design, this microcontroller delivers exceptional value and benefits to users looking to enhance their projects. Trust in Texas Instruments for top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the microcontroller from external damage.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75V, ensuring stable performance.

Package Shape: SQUARE

Square package shape ensures compact design and easy integration into electronic devices.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities for complex applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options for flexibility in design and compatibility with various systems.

No. of Terminals: 108

A higher number of terminals allows for more connectivity options and functionality in the microcontroller.

Package Style (Meter): GRID ARRAY

Grid array package style provides efficient signal routing and thermal performance.

Minimum Supply Voltage: 2.25 V

With a minimum supply voltage of 2.25V, the microcontroller can operate in low-power situations.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand a wide range of temperatures, ensuring reliability in harsh environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and connection in PCB layouts.

ROM Words: 131072

Large ROM capacity provides ample storage for program code and data.

Maximum Seated Height: 1.5 mm

Low seated height makes it suitable for slim and compact electronic devices.

Width: 10 mm

Compact width allows for space-saving integration in various electronic designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency ensures fast processing and responsiveness in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering during PCB assembly.

Length: 10 mm

Compact length contributes to the overall small form factor of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient and fast processing of instructions with reduced power consumption.

RAM Bytes: 65536

Large RAM capacity allows for efficient data storage and processing in applications with high memory requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form facilitates easy mounting and soldering during PCB assembly.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent performance and compatibility with power sources.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog signals for various applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast updates of firmware and software.

Terminal Pitch: 0.8 mm

Narrow terminal pitch provides high density integration in PCB layouts and space-saving designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.

Speed: 50 rpm

Operates at a speed of 50 rpm, suitable for a wide range of applications with moderate speed requirements.

No. of I/O Lines: 46

Multiple I/O lines provide versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6730-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6730-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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