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LM3S6633-EQC50-A2

Texas Instruments

LM3S6633-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S6633-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 41 I/O lines, PWM channels, and ADC channels. Ideal for industrial applications requiring a wide temperature range (-40 to 105 °C) and low power consumption (2.25-2.75 V).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,409 parts In-Stock

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Vyrian

USA . 1,607 parts In-Stock

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1,607

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Distributors (Availability)

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AZTECH Wire

Italy . 508 parts In-Stock

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$11.434

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$11.434

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One Stop Electronics

USA . 373 parts In-Stock

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$24.000

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Parana Technologies

USA . 556 parts In-Stock

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$40.690

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556

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DigiPath Technology Company

USA . 88 parts In-Stock

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$44.805

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$41.220

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88

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$41.220

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ChromeModa Solutions

Germany . 957 parts In-Stock

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$45.719

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$37.490

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957

$45.719

$37.490

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IDEA Electronic Components Group

UK . 855 parts In-Stock

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$45.719

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$43.433

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$41.147

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855

$45.719

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Corphita

USA . 3,466 parts In-Stock

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Microchip USA

USA . 194 parts In-Stock

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Overview

Experience unmatched quality and performance with the LM3S6633-EQC50-A2 microcontroller by Texas Instruments. As a trusted industry leader, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers. Whether you're looking to enhance your industrial automation systems or develop innovative IoT solutions, the LM3S6633-EQC50-A2 provides reliability, efficiency, and versatility like no other. Trust Texas Instruments for all your microcontroller needs and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and prevents damage to the microcontroller under normal operating conditions.

Package Shape: SQUARE

Square package shape offers efficient use of space on the circuit board, making it ideal for compact designs.

Bit Size: 32

32-bit architecture provides high computational capabilities and performance for demanding applications.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and integration with other components in the system.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliable operation in extreme cold conditions.

ADC Channels: YES

Integrated ADC channels enable analog input processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing complex programs and data, enabling versatile functionality.

RAM Bytes: 32768

Generous RAM size of 32768 bytes provides ample memory for data storage and processing, enhancing the efficiency of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 32 kHz ensures fast and responsive operation, suitable for real-time applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions typically encountered in industrial applications.

PWM Channels: YES

Integrated PWM channels support pulse width modulation, enabling precise control of signals and motor speed in various applications.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible updating of firmware and programs, enhancing the versatility and longevity of the microcontroller.

Technical Specifications

Microcontrollers LM3S6633-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6633-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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