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LM3S6611-IQC50-A2T

Texas Instruments

LM3S6611-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S6611-IQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,824 parts In-Stock

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Vyrian

USA . 2,495 parts In-Stock

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2,495

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AZTECH Wire

Italy . 626 parts In-Stock

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$15.973

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626

$15.973

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One Stop Electronics

USA . 126 parts In-Stock

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$21.000

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126

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Parana Technologies

USA . 1,389 parts In-Stock

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$23.007

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$23.654

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$23.007

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DigiPath Technology Company

USA . 553 parts In-Stock

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$25.334

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$23.307

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553

$25.334

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IDEA Electronic Components Group

UK . 845 parts In-Stock

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$25.851

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$24.558

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$23.266

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845

$25.851

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$23.266

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ChromeModa Solutions

Germany . 356 parts In-Stock

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$25.851

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$21.198

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356

$25.851

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Component Stockers USA

USA . 207 parts In-Stock

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$99.990

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Corphita

USA . 3,931 parts In-Stock

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Microchip USA

USA . 492 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S6611-IQC50-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability, making this microcontroller perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile device offers unmatched value, benefits, and advantages to customers looking to bring their ideas to life. Trust in Texas Instruments to provide the cutting-edge technology you need to stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the product easy to handle and resistant to impact and environmental stress.

Surface Mount: YES

Surface mount technology allows for higher component density, improved electrical performance, and efficient assembly processes.

Maximum Supply Voltage: 2.75 V

A moderate maximum supply voltage ensures safe operation and protects the components from damage.

Package Shape: SQUARE

The square shape allows for easy placement and orientation during assembly, maximizing space efficiency.

Bit Size: 32

A 32-bit architecture provides improved computational power and efficiency for processing complex instructions.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options enables flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 100

A high number of terminals allow for versatile input/output configurations and connectivity options.

Package Style (Meter): FLATPACK

The flatpack style offers efficient thermal management and electrical performance in a compact form factor.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage ensures reliable operation even under low power conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for analog input processing, enabling sensor interfacing and data conversion.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, enhancing signal integrity and electrical performance.

ROM Words: 131072

Large ROM capacity enables storing a significant amount of program data and instructions for efficient operation.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6 mm enables compact PCB designs and space-constrained applications.

Width: 14 mm

A narrow width of 14 mm allows for efficient space utilization on the PCB without compromising functionality.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz provides fast processing speed and responsiveness for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper solder melting and joint formation for robust connections.

Length: 14 mm

A compact length of 14 mm facilitates space-saving designs and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient processing power and optimized performance for embedded systems.

RAM Bytes: 32768

With 32768 bytes of RAM, the product can efficiently store and access data during operation for enhanced system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and improved performance for energy-efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joints and ease of soldering during PCB assembly for robust connections.

Nominal Supply Voltage: 2.5 V

A stable nominal supply voltage of 2.5 V ensures consistent performance and reliable operation of the product.

PWM Channels: YES

Integrated PWM channels enable precision control of analog outputs for applications such as motor control and lighting dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customizable configurations for versatile application compatibility.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5 mm, the product offers high-density packaging and efficient routing on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring proper handling and storage to prevent moisture-related damage.

Speed: 50 rpm

Operating at a speed of 50 rpm, the product can process instructions quickly and efficiently for responsive system performance.

No. of I/O Lines: 46

With 46 I/O lines, the product offers ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6611-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6611-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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