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LM3S6610-EQC25-A2T

Texas Instruments

LM3S6610-EQC25-A2T by Texas Instruments

Texas Instruments LM3S6610-EQC25-A2T is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,399 parts In-Stock

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4,399

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Vyrian

USA . 2,829 parts In-Stock

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2,829

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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One Stop Electronics

USA . 1,303 parts In-Stock

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$1.000

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1,303

$1.000

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Ampacity Inc.

Singapore . 641 parts In-Stock

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$1.000

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641

$1.000

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AZTECH Wire

Italy . 456 parts In-Stock

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$13.731

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456

$13.731

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Parana Technologies

USA . 1,824 parts In-Stock

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$16.743

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$1,554.812

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$15.068

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1,824

$16.743

$1,554.812

$15.068

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DigiPath Technology Company

USA . 966 parts In-Stock

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$18.436

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966

$18.436

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IDEA Electronic Components Group

UK . 397 parts In-Stock

1+ parts

$18.812

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$17.871

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$16.931

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397

$18.812

$17.871

$16.931

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ChromeModa Solutions

Germany . 359 parts In-Stock

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$18.812

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$15.426

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359

$18.812

$15.426

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Microchip USA

USA . 423 parts In-Stock

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$27.460

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$27.060

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$26.870

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$26.670

423

$27.460

$27.060

$26.870

$26.670

QUARKTWIN TECHNOLOGY LTD

USA . 28,508 parts In-Stock

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Corphita

USA . 1,716 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Experience the power and versatility of the LM3S6610-EQC25-A2T by Texas Instruments, a cutting-edge microcontroller that delivers unparalleled performance in a compact package. Designed with precision and expertise, Texas Instruments ensures top-notch quality and reliability in every product. Ideal for a wide range of applications, this microcontroller offers seamless integration, high-speed processing, and efficient power management. Elevate your projects with the LM3S6610-EQC25-A2T and unlock endless possibilities. Welcome to the future of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength and insulation, making the product durable and safe to use.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, saving space and time during production.

Maximum Supply Voltage: 2.75 V

Providing a stable power supply within this range ensures the microcontroller operates efficiently and reliably.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and perform more complex operations, suitable for a wide range of applications.

Power Supplies (V): 2.5,3.3

Supporting multiple power supply options allows flexibility in different applications, accommodating varying voltage requirements.

No. of Terminals: 100

Having a high number of terminals enables connectivity to other components and peripherals, expanding the functionality of the microcontroller.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller can withstand harsh conditions and operate reliably in demanding settings.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store extensive program code and data, enabling versatile application development.

RAM Bytes: 32768

Sufficient RAM capacity allows for efficient data storage and retrieval, supporting multitasking and complex algorithms.

ROM Programmability: FLASH

Flash ROM offers reprogrammability, allowing for easy updates and modifications to the firmware without requiring physical replacement of memory chips.

Technical Specifications

Microcontrollers LM3S6610-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6610-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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