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LM3S6610-EQC25-A2

Texas Instruments

LM3S6610-EQC25-A2 by Texas Instruments

LM3S6610-EQC25-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and ADC channels for analog signal conversion. With a package style of FLATPACK and GULL WING terminal form, it offers compact design and ease of integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,737 parts In-Stock

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4,737

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Digiode

USA . 4,569 parts In-Stock

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4,569

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$11.337

100+ parts

-

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432

$11.337

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One Stop Electronics

USA . 1,487 parts In-Stock

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$24.000

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1,487

$24.000

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Parana Technologies

USA . 183 parts In-Stock

1+ parts

$25.911

100+ parts

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$26.510

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183

$25.911

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$26.510

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ChromeModa Solutions

Germany . 2,288 parts In-Stock

1+ parts

$29.113

100+ parts

$23.873

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2,288

$29.113

$23.873

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IDEA Electronic Components Group

UK . 169 parts In-Stock

1+ parts

$29.113

100+ parts

$27.657

1k+ parts

$26.202

10k+ parts

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169

$29.113

$27.657

$26.202

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Corphita

USA . 2,311 parts In-Stock

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2,311

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DigiPath Technology Company

USA . 996 parts In-Stock

1+ parts

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$26.248

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996

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$26.248

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Microchip USA

USA . 199 parts In-Stock

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199

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Overview

Unlock the power of innovation with the LM3S6610-EQC25-A2 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers quality and reliability like no other. Perfect for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers seeking high performance and efficiency. Experience seamless integration, versatile functionality, and cutting-edge features with the LM3S6610-EQC25-A2. Elevate your projects to new heights with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction of the package body makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V provides flexibility in power supply options while ensuring safe operation.

Package Shape: SQUARE

The square package shape offers a compact design that can fit well in tight spaces or densely populated PCBs.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities and higher performance compared to lower bit sizes.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages of 2.5V and 3.3V offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and enables the product to interface with a wide range of external devices.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage requirement of 2.25V ensures stable operation even under low-power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand elevated temperatures and harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate in a wide temperature range from -40°C to 105°C makes it suitable for industrial applications in varying climates.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to read and process analog sensor data.

Terminal Position: QUAD

The quad terminal position provides a balanced layout for connectivity, ensuring optimal signal integrity and ease of PCB routing.

ROM Words: 131072

With a large ROM capacity of 131072 words, the microcontroller can store complex program instructions and data for efficient execution.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm minimizes the overall profile of the product, making it suitable for compact and thin designs.

Width: 14 mm

The 14mm width provides a balance between compactness and ease of handling during installation and placement on a PCB.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032MHz allows the microcontroller to perform tasks rapidly and efficiently, enhancing overall system performance.

Length: 14 mm

The 14mm length offers a compact form factor that can be easily accommodated in space-constrained electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the microcontroller can withstand harsh operating conditions typically found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring RISC architecture, this microcontroller offers simplified instruction sets and faster execution, making it ideal for real-time embedded applications.

RAM Bytes: 32768

The generous RAM capacity of 32768 bytes allows for efficient data storage and manipulation, enhancing the microcontroller's processing capabilities.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull-wing terminal form offers secure solder connections and easy automated assembly, ensuring reliable electrical connections.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and efficient operation within the recommended voltage range.

PWM Channels: YES

Having PWM channels allows for precise control of connected devices, enabling the microcontroller to generate analog signals with varying duty cycles.

ROM Programmability: FLASH

The programmability of ROM using flash technology allows for easy and fast updates to the microcontroller's firmware, enhancing flexibility and adaptability.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting on PCBs, saving space and accommodating complex circuit designs.

Speed: 25 rpm

With a speed rating of 25 rpm, this microcontroller can process instructions and data at a rapid pace, meeting the demands of high-performance applications.

No. of I/O Lines: 46

Having 46 I/O lines offers extensive connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM3S6610-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6610-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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