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LM3S6537-IBZ50-A2T

Texas Instruments

LM3S6537-IBZ50-A2T by Texas Instruments

Texas Instruments' LM3S6537-IBZ50-A2T is a 32-bit microcontroller with 108 terminals, operating at up to 50 MHz. Ideal for industrial applications, it features 65KB RAM, 98KB ROM, and supports ADC and PWM channels. With a wide temperature range (-40 to 85°C) and low supply voltage (2.25-2.75V), it's suitable for various embedded systems requiring high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,507 parts In-Stock

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Digiode

USA . 4,579 parts In-Stock

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4,579

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Distributors (Availability)

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AZTECH Wire

Italy . 697 parts In-Stock

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$5.975

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697

$5.975

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One Stop Electronics

USA . 1,170 parts In-Stock

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$6.000

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Parana Technologies

USA . 1,724 parts In-Stock

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$61.101

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$61.101

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DigiPath Technology Company

USA . 84 parts In-Stock

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$67.280

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$61.898

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84

$67.280

$61.898

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ChromeModa Solutions

Germany . 6,430 parts In-Stock

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$68.653

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$56.295

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6,430

$68.653

$56.295

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IDEA Electronic Components Group

UK . 1,151 parts In-Stock

1+ parts

$68.653

100+ parts

$65.220

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$61.788

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1,151

$68.653

$65.220

$61.788

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Corphita

USA . 3,680 parts In-Stock

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Microchip USA

USA . 3,437 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S6537-IBZ50-A2T by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-quality products that exceed industry standards. This versatile microcontroller is ideal for a wide range of applications, providing customers with unmatched value and performance. Whether you're in the industrial sector or developing cutting-edge consumer electronics, this product offers reliability, efficiency, and precision to help you bring your ideas to life. Elevate your projects with the LM3S6537-IBZ50-A2T and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and offers good protection for the microcontroller, ensuring its longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 2.75 V

Operates efficiently within the specified voltage range, providing stable performance.

Bit Size: 32

32-bit architecture offers enhanced processing power and efficiency for handling complex tasks.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, allowing flexibility in the system design.

No. of Terminals: 108

Ample terminals provide connectivity options for various peripherals and interfaces.

Package Style (Meter): GRID ARRAY

Grid array package style enables efficient heat dissipation and space-saving on the PCB.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature environments, suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish ensures good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, expanding the microcontroller's capabilities.

ROM Words: 98304

Large ROM capacity accommodates complex program codes and data storage requirements.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speed for time-critical operations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance by simplifying instruction set and reducing execution time.

RAM Bytes: 65536

Generous RAM capacity allows for efficient data storage and processing during operation.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the microcontroller's firmware.

Speed: 50 rpm

Operates at a speed of 50 rounds per minute, suitable for various motor control applications.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring adequate storage and handling precautions.

No. of I/O Lines: 41

Ample I/O lines allow for seamless communication and control of external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6537-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6537-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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