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LM3S6422-EQC25-A2T

Texas Instruments

LM3S6422-EQC25-A2T by Texas Instruments

Texas Instruments LM3S6422-EQC25-A2T is a 32-bit microcontroller with 32768 RAM bytes and 98304 ROM words. Operating at -40 to 105 °C, it has PWM channels, ADC support, and runs at 0.032 MHz clock frequency. Ideal for industrial applications requiring a compact design with 34 I/O lines and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,731 parts In-Stock

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Digiode

USA . 1,045 parts In-Stock

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1,045

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Distributors (Availability)

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AZTECH Wire

Italy . 537 parts In-Stock

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$17.629

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537

$17.629

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Parana Technologies

USA . 1,662 parts In-Stock

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$20.649

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$20.759

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$20.649

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$20.759

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DigiPath Technology Company

USA . 1,482 parts In-Stock

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$22.737

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$20.918

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1,482

$22.737

$20.918

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ChromeModa Solutions

Germany . 2,593 parts In-Stock

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$23.201

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$19.025

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2,593

$23.201

$19.025

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IDEA Electronic Components Group

UK . 1,896 parts In-Stock

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$23.201

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$22.041

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$20.881

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1,896

$23.201

$22.041

$20.881

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One Stop Electronics

USA . 1,207 parts In-Stock

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$35.000

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Corphita

USA . 852 parts In-Stock

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Microchip USA

USA . 176 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the LM3S6422-EQC25-A2T microcontroller. This cutting-edge device offers a multitude of applications in various industries, providing unparalleled value and benefits to customers. With advanced technology, superior performance, and innovative features, this microcontroller is the perfect choice for your next project. Trust Texas Instruments for top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe and stable operation of the microcontroller within its specified limits.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and process large amounts of data efficiently.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 100

Having 100 terminals provides ample connective options for interfacing with other components and peripherals.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can function reliably even in harsh environments or extreme cold conditions.

ROM Words: 98304

With a large ROM size of 98304 words, this microcontroller can store a significant amount of program data and instructions.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 0.032 MHz allows for high-speed operation and efficient processing of instructions.

RAM Bytes: 32768

With a generous RAM size of 32768 bytes, this microcontroller can handle data manipulation and storage effectively.

Technical Specifications

Microcontrollers LM3S6422-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

34

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6422-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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