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LM3S6422-EQC25-A2

Texas Instruments

LM3S6422-EQC25-A2 by Texas Instruments

LM3S6422-EQC25-A2 by Texas Instruments is a 32-bit microcontroller with 98304 ROM words and 32768 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 34 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,163 parts In-Stock

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7,163

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Digiode

USA . 4,661 parts In-Stock

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4,661

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Distributors (Availability)

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AZTECH Wire

Italy . 542 parts In-Stock

1+ parts

$5.064

100+ parts

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542

$5.064

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One Stop Electronics

USA . 877 parts In-Stock

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$15.000

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877

$15.000

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Parana Technologies

USA . 1,970 parts In-Stock

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$52.643

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1,970

$52.643

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ChromeModa Solutions

Germany . 6,590 parts In-Stock

1+ parts

$59.149

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$48.502

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6,590

$59.149

$48.502

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$59.149

100+ parts

$56.192

1k+ parts

$53.234

10k+ parts

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1,620

$59.149

$56.192

$53.234

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Corphita

USA . 1,100 parts In-Stock

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1,100

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DigiPath Technology Company

USA . 695 parts In-Stock

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$53.329

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695

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$53.329

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Microchip USA

USA . 141 parts In-Stock

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141

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Overview

Unleash the power of innovation with the LM3S6422-EQC25-A2 microcontroller by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers unparalleled performance in the field of microcontrollers. This versatile device is perfect for a wide range of applications, offering customers seamless integration and high efficiency. Whether you're looking to enhance your automation systems or improve your embedded designs, this microcontroller provides exceptional value, benefits, and advantages that will take your projects to the next level. Elevate your creations with the LM3S6422-EQC25-A2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 2.75 V

Suitable for low power applications, helping to conserve energy.

Bit Size: 32

Offers a high level of processing power and capability.

No. of Terminals: 100

Provides ample connectivity options for various external devices and components.

ROM Words: 98304

Offers a large storage capacity for program and data storage.

RAM Bytes: 32768

Sufficient memory for temporary data storage and processing.

Technology: CMOS

Uses low power consumption, making it energy efficient.

PWM Channels: YES

Allows for precise control of analog devices such as motors and LEDs.

Technical Specifications

Microcontrollers LM3S6422-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

34

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6422-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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