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LM3S6420-EQC25-A2T

Texas Instruments

LM3S6420-EQC25-A2T by Texas Instruments

LM3S6420-EQC25-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC channels and PWM functionality. With a temperature range from -40 to 105 °C, it offers versatile performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,558 parts In-Stock

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Digiode

USA . 4,324 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 230 parts In-Stock

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$18.567

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One Stop Electronics

USA . 1,577 parts In-Stock

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$31.000

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Parana Technologies

USA . 2,059 parts In-Stock

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$67.183

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DigiPath Technology Company

USA . 378 parts In-Stock

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$73.977

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378

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ChromeModa Solutions

Germany . 3,782 parts In-Stock

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$75.487

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$61.899

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$61.899

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IDEA Electronic Components Group

UK . 680 parts In-Stock

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$75.487

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$71.713

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$67.938

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680

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$67.938

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Corphita

USA . 4,659 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,967 parts In-Stock

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Microchip USA

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Overview

Experience the next level of performance and reliability with the LM3S6420-EQC25-A2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and efficient. With a wide range of applications in various industries, this product offers unmatched value, benefits, and advantages to customers. Whether you're looking for precision control or reliable operation, the LM3S6420-EQC25-A2T is the perfect choice for your next project. Trust in Texas Instruments for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and resistance to heat and chemicals.

Surface Mount: YES

This feature allows for easy installation on printed circuit boards, saving time and space.

Maximum Supply Voltage: 2.75 V

Ideal for low power applications, ensuring the safety of the device and components.

Bit Size: 32

Provides sufficient processing power for various applications that require data manipulation and control.

Power Supplies (V): 2.5,3.3

Offers flexibility in power options, allowing compatibility with different systems and voltage requirements.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other devices and components.

Package Style (Meter): FLATPACK

The flatpack design ensures easy integration and space-saving on PCBs.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments where the temperature can vary, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for a wide range of operating conditions.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for sensor interfacing and measurement applications.

Terminal Position: QUAD

Quad terminal position provides stability and ease of soldering during installation.

ROM Words: 98304

Ample memory capacity for storing program instructions and data, suitable for complex applications.

Width: 14 mm

Compact size for space-constrained applications and PCB designs.

Maximum Clock Frequency: 0.032 MHz

Offers high-speed processing for quick response times in controlling various functions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered devices.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance and reliability of the microcontroller.

No. of I/O Lines: 46

Sufficient number of I/O lines for interfacing with external devices and peripherals, enhancing versatility.

Technical Specifications

Microcontrollers LM3S6420-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6420-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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