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LM3S6420-EQC25-A2

Texas Instruments

LM3S6420-EQC25-A2 by Texas Instruments

LM3S6420-EQC25-A2 by Texas Instruments is a 32-bit microcontroller with 32768 RAM Bytes and 98304 ROM Words. Operating at a max clock frequency of 0.032 MHz, it is suitable for industrial applications requiring PWM channels and ADC functionality. With a package style of FLATPACK and GULL WING terminal form, this microcontroller offers versatile performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,709 parts In-Stock

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4,709

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Digiode

USA . 1,998 parts In-Stock

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1,998

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Distributors (Availability)

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AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$16.210

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428

$16.210

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One Stop Electronics

USA . 1,315 parts In-Stock

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$31.000

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1,315

$31.000

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Parana Technologies

USA . 1,482 parts In-Stock

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$66.966

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$66.966

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DigiPath Technology Company

USA . 782 parts In-Stock

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$73.738

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782

$73.738

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ChromeModa Solutions

Germany . 5,569 parts In-Stock

1+ parts

$75.243

100+ parts

$61.699

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5,569

$75.243

$61.699

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IDEA Electronic Components Group

UK . 1,064 parts In-Stock

1+ parts

$75.243

100+ parts

$71.481

1k+ parts

$67.719

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1,064

$75.243

$71.481

$67.719

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Corphita

USA . 3,105 parts In-Stock

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Microchip USA

USA . 161 parts In-Stock

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Overview

Experience the cutting-edge technology of the LM3S6420-EQC25-A2 by Texas Instruments, a high-quality microcontroller designed for a wide range of applications. With its advanced features and reliable performance, this product is sure to exceed your expectations. Benefit from Texas Instruments' reputation for excellence in manufacturing and unlock the full potential of your projects with the unmatched value and advantages that this microcontroller offers. Explore endless possibilities and take your designs to the next level with the LM3S6420-EQC25-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight package material, suitable for various applications.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 2.75 V

Allows for efficient power management and operation within specified voltage range.

Package Shape: SQUARE

Compact shape that optimizes space utilization on PCBs.

Bit Size: 32

Efficient processing capacity for handling complex tasks and computations.

Power Supplies (V): 2.5, 3.3

Provides flexibility in power options, suitable for a variety of applications.

No. of Terminals: 100

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack design for easy mounting and secure connection on PCBs.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even at low supply voltage levels.

Maximum Operating Temperature: 105 °C

Capable of operating in high temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions without impacting functionality.

ADC Channels: YES

Integrated analog-to-digital converters for data acquisition and processing.

Terminal Position: QUAD

Quad terminal layout for efficient connectivity and signal routing.

ROM Words: 98304

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-saving PCB layout.

Width: 14 mm

Optimal width dimension for fitting into standard PCB designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast and efficient processing capabilities.

Length: 14 mm

Compact length size for easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller for streamlined and efficient data processing.

RAM Bytes: 32768

Sufficient RAM capacity for temporary data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high performance operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and connectivity on PCBs.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent and reliable operation.

PWM Channels: YES

Pulse-width modulation channels for precise control of output signals.

ROM Programmability: FLASH

Flash programmable ROM for easy and quick updates of firmware and data.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and high-density mounting on PCBs.

Speed: 25 rpm

Capable of high-speed processing and data transfer rates.

No. of I/O Lines: 46

Sufficient number of input/output lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6420-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6420-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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