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LM3S628-IGZ50-C2T

Texas Instruments

LM3S628-IGZ50-C2T by Texas Instruments

LM3S628-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 32768 ROM words, and 8192 RAM bytes. It operates in industrial temperature range (-40 to 85 °C) and features PWM channels for various applications requiring high-speed processing and ADC functionality. With a compact chip carrier package style, it is suitable for space-constrained designs in industries like automation and robotics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,950 parts In-Stock

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Vyrian

USA . 2,861 parts In-Stock

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2,861

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AZTECH Wire

Italy . 729 parts In-Stock

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$7.136

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One Stop Electronics

USA . 429 parts In-Stock

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$26.000

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Parana Technologies

USA . 1,939 parts In-Stock

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$61.243

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ChromeModa Solutions

Germany . 2,398 parts In-Stock

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$68.812

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IDEA Electronic Components Group

UK . 2,159 parts In-Stock

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$68.812

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$65.371

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$61.931

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QUARKTWIN TECHNOLOGY LTD

USA . 21,268 parts In-Stock

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Microchip USA

USA . 1,450 parts In-Stock

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DigiPath Technology Company

USA . 1,279 parts In-Stock

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Corphita

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments LM3S628-IGZ50-C2T microcontroller. Built by a trusted industry leader, this high-quality chip offers unmatched performance and reliability for a wide range of applications. Whether you're designing IoT devices, robotics, or industrial automation systems, this versatile microcontroller delivers exceptional value with its advanced features and efficient design. Stay ahead of the competition and bring your innovative ideas to life with the LM3S628-IGZ50-C2T from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V provides flexibility in power supply options for the microcontroller.

Package Shape: SQUARE

Square package shape helps in easier mounting and alignment in circuit board designs.

Bit Size: 32

32-bit architecture allows for higher computational power and processing capabilities.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures reliable and efficient performance of the microcontroller.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external devices and components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal conductivity and electrical performance for the microcontroller.

Minimum Supply Voltage: 3 V

Can operate under a minimum supply voltage of 3V, enabling operation in low power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the microcontroller can withstand industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40°C to 85°C supports operation in harsh environments with varying temperatures.

ADC Channels: YES

Integration of ADC channels enables analog-to-digital conversion, essential for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of connections on the microcontroller, improving layout design.

ROM Words: 32768

Large ROM capacity of 32768 words provides ample storage for program memory and data storage.

Maximum Seated Height: 1 mm

Low seated height of 1mm makes this microcontroller suitable for compact and slim device designs.

Width: 6.875 mm

Narrow width of 6.875mm allows for space-efficient placement on a circuit board.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32 MHz allows for fast processing and execution of instructions.

Length: 6.875 mm

Compact length of 6.875mm contributes to the overall space-saving design of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and streamlined instruction execution, enhancing overall performance of the microcontroller.

RAM Bytes: 8192

Generous RAM capacity of 8192 bytes supports data storage and manipulation for complex applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, optimizing energy efficiency of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process and reduces the risk of soldering defects.

Maximum Supply Current: 110 mA

Maximum supply current of 110mA ensures stable and sufficient power delivery to the microcontroller.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides a standard power level for consistent performance across different applications.

PWM Channels: YES

Support for PWM channels enables precise control of output signals, essential for motor control and analog signal modulation.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the program memory without the need for external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and efficient use of board space.

Speed: 50 rpm

Operating speed of 50 rpm ensures rapid signal processing and execution of tasks for time-critical applications.

No. of I/O Lines: 28

Ample I/O lines provide versatility in interfacing with external devices and sensors, enhancing the microcontroller's connectivity capabilities.

Technical Specifications

Microcontrollers LM3S628-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S628-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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