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LM3S618-IQN50-C2T

Texas Instruments

LM3S618-IQN50-C2T by Texas Instruments

LM3S618-IQN50-C2T by Texas Instruments is a 32-bit microcontroller with 8KB RAM and 32KB ROM, ideal for industrial applications. It features 6-channel 10-bit ADCs, PWM channels, and UART connectivity. With a max clock frequency of 0.032 MHz and low power mode, it offers efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,780 parts In-Stock

1+ parts

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5,780

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Digiode

USA . 1,954 parts In-Stock

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1,954

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Distributors (Availability)

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$18.537

100+ parts

-

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414

$18.537

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Microchip USA

USA . 4,382 parts In-Stock

1+ parts

$21.150

100+ parts

$20.850

1k+ parts

$20.700

10k+ parts

$20.550

4,382

$21.150

$20.850

$20.700

$20.550

One Stop Electronics

USA . 1,041 parts In-Stock

1+ parts

$22.000

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1,041

$22.000

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$27.243

100+ parts

$26.970

1k+ parts

$25.881

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100

$27.243

$26.970

$25.881

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Parana Technologies

USA . 306 parts In-Stock

1+ parts

$53.476

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306

$53.476

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DigiPath Technology Company

USA . 1,868 parts In-Stock

1+ parts

$58.883

100+ parts

$54.173

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1,868

$58.883

$54.173

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ChromeModa Solutions

Germany . 5,976 parts In-Stock

1+ parts

$60.085

100+ parts

$49.270

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5,976

$60.085

$49.270

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IDEA Electronic Components Group

UK . 2,326 parts In-Stock

1+ parts

$60.085

100+ parts

$57.081

1k+ parts

$54.076

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2,326

$60.085

$57.081

$54.076

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Component Stockers USA

USA . 590 parts In-Stock

1+ parts

$99.990

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590

$99.990

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Lixinc

USA . 6,498 parts In-Stock

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6,498

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Corphita

USA . 3,033 parts In-Stock

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Overview

Unlock a world of possibilities with the LM3S618-IQN50-C2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their microcontrollers. Ideal for a wide range of applications, this product offers integrated cache, low power mode, and a variety of peripherals to enhance functionality. Experience seamless connectivity with SSI and UART options, while enjoying the benefits of low power consumption and high performance. Elevate your projects with the LM3S618-IQN50-C2T and discover the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Integrated Cache: YES

Improves processing speed by storing frequently used data for quick access.

Maximum Supply Voltage: 3.6 V

Allows for safe operation within specified voltage range without risk of damage.

CPU Family: CORTEX-M3

Efficient and reliable processor architecture for enhanced performance.

ROM Words: 32768

Sufficient memory capacity for storing program instructions and data.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature range for reliable performance in harsh environments.

Analog To Digital Convertors: 6-Ch 10-Bit

Enables precise conversion of analog signals to digital data for accurate processing and control.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and improved system performance.

Moisture Sensitivity Level (MSL): 3

Suitable for handling during manufacturing and assembly processes with moderate sensitivity to moisture.

Speed: 50 rpm

Capable of providing fast processing speed for real-time applications and control systems.

Technical Specifications

Microcontrollers LM3S618-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SSI, UART(2)

Peripherals:

PWM(6), QEI, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S618-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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