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LM3S618-IGZ50-C2T

Texas Instruments

LM3S618-IGZ50-C2T by Texas Instruments

LM3S618-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring a microcontroller with PWM channels, ADC channels, and ROM programmability in a compact chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,115 parts In-Stock

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Vyrian

USA . 3,816 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 223 parts In-Stock

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$7.017

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One Stop Electronics

USA . 928 parts In-Stock

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$24.000

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Parana Technologies

USA . 1,483 parts In-Stock

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$31.913

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$91.551

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DigiPath Technology Company

USA . 23 parts In-Stock

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$35.140

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23

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ChromeModa Solutions

Germany . 5,827 parts In-Stock

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$35.857

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$29.403

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IDEA Electronic Components Group

UK . 338 parts In-Stock

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$35.857

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$34.064

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$32.271

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338

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Microchip USA

USA . 2,336 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the LM3S618-IGZ50-C2T by Texas Instruments. This cutting-edge microcontroller is designed to deliver top-notch performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to IoT devices, this versatile chip offers unmatched precision and efficiency. Trust in Texas Instruments' renowned quality and expertise to bring your projects to the next level. Elevate your creations with the LM3S618-IGZ50-C2T and experience a world of possibilities at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packages make installation easier and more reliable.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

Package Shape: SQUARE

Square packages are easy to handle and mount on PCBs.

Bit Size: 32

32-bit architecture offers higher performance and processing capabilities.

Power Supplies (V): 3.3

Standard power supply voltage for many applications.

No. of Terminals: 48

Sufficient number of terminals for connecting peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are compact and provide good thermal performance.

Minimum Supply Voltage: 3 V

Wide range of supply voltage compatibility.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions.

ADC Channels: YES

Analog to digital converter channels for interfacing with analog sensors.

Terminal Position: QUAD

Quad terminal position allows for easy connection.

ROM Words: 32768

Large ROM capacity for storing program code.

Maximum Seated Height: 1 mm

Low profile package design for compact applications.

Width: 6.875 mm

Compact width for space-constrained designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing.

Length: 6.875 mm

Compact length for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial grade temperature specifications for robust performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing.

RAM Bytes: 8192

Sufficient RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: NO LEAD

No lead terminals for compact and reliable connection.

Maximum Supply Current: 110 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Nominal voltage for stable and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels for controlling motor speed and power.

ROM Programmability: FLASH

Flash programmable ROM for easy code updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high density mounting.

Speed: 50 rpm

Operates at a speed of 50 revolutions per minute.

No. of I/O Lines: 30

Sufficient number of I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S618-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S618-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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