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LM3S618-EGZ50-C2

Texas Instruments

LM3S618-EGZ50-C2 by Texas Instruments

LM3S618-EGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring a powerful yet compact chip carrier package with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,833 parts In-Stock

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3,833

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Digiode

USA . 840 parts In-Stock

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840

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AZTECH Wire

Italy . 618 parts In-Stock

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$12.462

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618

$12.462

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One Stop Electronics

USA . 1,377 parts In-Stock

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$14.000

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1,377

$14.000

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Parana Technologies

USA . 1,699 parts In-Stock

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$28.314

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$46.075

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1,699

$28.314

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$46.075

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ChromeModa Solutions

Germany . 5,833 parts In-Stock

1+ parts

$31.814

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$26.087

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5,833

$31.814

$26.087

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

1+ parts

$31.814

100+ parts

$30.223

1k+ parts

$28.633

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1,040

$31.814

$30.223

$28.633

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Microchip USA

USA . 2,114 parts In-Stock

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2,114

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Corphita

USA . 988 parts In-Stock

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DigiPath Technology Company

USA . 242 parts In-Stock

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$28.684

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242

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$28.684

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Overview

Unlock the power of innovation with the LM3S618-EGZ50-C2 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers superior quality and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and efficiency. With advanced features and a compact design, this product provides exceptional value and benefits to customers looking to take their projects to the next level. Experience the advantages of cutting-edge technology with the LM3S618-EGZ50-C2.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Maximum Supply Voltage: 3.6 V

Operating with a maximum supply voltage of 3.6V provides flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for easy placement and routing on the PCB, optimizing space usage.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and data processing efficiently.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with a wide range of power sources and systems.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers durability and protection for the microcontroller, making it suitable for rugged industrial applications.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, this microcontroller can operate efficiently even with lower power sources.

Maximum Operating Temperature: 105 °C

Operating at a high temperature range of up to 105°C makes this microcontroller suitable for industrial environments with demanding thermal conditions.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40°C ensures reliable performance in extreme cold environments.

ADC Channels: YES

Having ADC channels enables analog sensor data to be converted to digital signals accurately for processing.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection to external components, improving ease of use during assembly.

ROM Words: 32768

With 32768 ROM words, this microcontroller offers ample memory for storing program instructions and data.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this microcontroller can fit into slim and compact electronic devices.

Width: 6.875 mm

Compact width of 6.875mm allows for space-efficient PCB layout and design.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032MHz ensures fast data processing and execution speed.

Length: 6.875 mm

Compact length of 6.875mm provides flexibility in PCB design and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller offers efficient and optimized performance for handling complex tasks and computations.

RAM Bytes: 8192

Having 8192 RAM bytes provides sufficient memory for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process during assembly, ensuring secure and reliable connections.

Maximum Supply Current: 110 mA

Operating with a maximum supply current of 110mA ensures efficient power usage and prevents overloading of the electrical system.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V provides stable and consistent power supply to the microcontroller.

PWM Channels: YES

Having PWM channels allows for precise control of output signals, making this microcontroller suitable for applications requiring modulation and control of digital signals.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in programming and updating the microcontroller's firmware, enabling easy customization and maintenance.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller ensures high-density packaging and efficient use of PCB space.

Speed: 50 rpm

Operating at a speed of 50rpm, this microcontroller can process instructions and tasks quickly, suitable for real-time applications.

No. of I/O Lines: 30

Having 30 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making this microcontroller versatile in various applications.

Technical Specifications

Microcontrollers LM3S618-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S618-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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