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LM3S617-IGZ50-C2T

Texas Instruments

LM3S617-IGZ50-C2T by Texas Instruments

LM3S617-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max clock frequency of 0.032 MHz. It features 8192 bytes of RAM and 32768 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,485 parts In-Stock

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Digiode

USA . 3,411 parts In-Stock

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3,411

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AZTECH Wire

Italy . 637 parts In-Stock

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$9.116

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637

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One Stop Electronics

USA . 1,489 parts In-Stock

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$29.000

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$29.000

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Parana Technologies

USA . 1,690 parts In-Stock

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$46.067

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$46.067

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DigiPath Technology Company

USA . 1,556 parts In-Stock

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$50.726

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$46.668

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1,556

$50.726

$46.668

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ChromeModa Solutions

Germany . 6,376 parts In-Stock

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$51.761

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$42.444

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6,376

$51.761

$42.444

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IDEA Electronic Components Group

UK . 706 parts In-Stock

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$51.761

100+ parts

$49.173

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$46.585

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706

$51.761

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$46.585

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Corphita

USA . 3,012 parts In-Stock

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Microchip USA

USA . 2,533 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S617-IGZ50-C2T by Texas Instruments, a high-quality microcontroller designed to elevate your projects to new heights. With Texas Instruments' reputation for excellence in manufacturing, this microcontroller offers unparalleled performance and reliability. Ideal for a wide range of applications, this chip carrier package provides 32-bit power, ADC channels, PWM channels, and more. Experience seamless operation and innovative solutions with the LM3S617-IGZ50-C2T, where value meets functionality.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and compact soldering onto a circuit board, saving space and making assembly process more efficient.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for uniform placement on a circuit board, ensuring a neat and organized layout.

Bit Size: 32

32-bit architecture allows for processing more complex instructions and data, enhancing overall performance.

Power Supplies (V): 3.3

Operates on low power supply, which can be beneficial for energy-efficient designs.

No. of Terminals: 48

Plenty of terminals provide connectivity options for peripherals and external components, increasing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER

Chip carrier style packaging ensures durability and structural integrity of the microcontroller, making it suitable for various environments.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage requirement, this microcontroller can operate in a wide range of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in cold environments or outdoor applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors or signals, increasing its functionality.

Terminal Position: QUAD

Quad terminal position offers convenient connectivity layout for peripherals and external devices.

ROM Words: 32768

Large ROM capacity allows for storing a significant amount of program instructions and data, expanding the capabilities of the microcontroller.

Maximum Seated Height: 1 mm

Low seated height makes the microcontroller suitable for compact electronic devices or applications with limited space.

Width: 6.875 mm

Narrow width enables the microcontroller to fit in tight spaces or small form factor designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast processing speed, ideal for applications requiring real-time data processing or high-speed computation.

Length: 6.875 mm

Compact length contributes to the overall small footprint of the microcontroller, aiding in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature handling ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller provides efficient processing power and reduced instruction set complexity for faster execution of tasks.

RAM Bytes: 8192

Ample RAM capacity allows for efficient temporary data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and error-free operation of the microcontroller.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process and enhances the durability of the connections in the circuit board.

Maximum Supply Current: 110 mA

Low supply current requirement ensures minimal power consumption during operation, beneficial for battery-powered devices or energy-efficient applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller in various power supply conditions.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog outputs, making the microcontroller suitable for applications requiring accurate voltage or current regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the device, enabling firmware updates and customization of functionalities.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density integration on a circuit board, maximizing connectivity options and space utilization.

Speed: 50 rpm

High speed capability makes the microcontroller suitable for applications requiring fast data processing or rapid response times.

No. of I/O Lines: 30

Abundance of I/O lines provides flexible input/output options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S617-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S617-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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