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LM3S617-IGZ50-C2

Texas Instruments

LM3S617-IGZ50-C2 by Texas Instruments

LM3S617-IGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and 32768 ROM words. It operates at a max clock frequency of 0.032 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,439 parts In-Stock

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Digiode

USA . 799 parts In-Stock

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799

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AZTECH Wire

Italy . 545 parts In-Stock

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$18.819

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One Stop Electronics

USA . 208 parts In-Stock

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$22.000

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Parana Technologies

USA . 334 parts In-Stock

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$76.276

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DigiPath Technology Company

USA . 1,006 parts In-Stock

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$83.989

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$77.270

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ChromeModa Solutions

Germany . 6,334 parts In-Stock

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$85.703

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$70.276

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IDEA Electronic Components Group

UK . 1,371 parts In-Stock

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$85.703

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$81.418

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$77.133

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Corphita

USA . 3,549 parts In-Stock

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A-Z Elektronik GmbH

Germany . 129 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Unlock the power of seamless technology with the Texas Instruments LM3S617-IGZ50-C2 microcontroller. Crafted with precision and expertise, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides exceptional value, delivering benefits like efficient performance, low power consumption, and versatile functionality. Experience the advantages of cutting-edge innovation and elevate your projects to new heights with the LM3S617-IGZ50-C2 by Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to integrate this microcontroller into PCB designs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, providing flexibility in power supply design.

Package Shape: SQUARE

Square package shape can facilitate efficient placement on the PCB and make it easier for automated assembly.

Bit Size: 32

32-bit architecture enables efficient processing of data and instructions, suitable for handling complex tasks.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent performance of the microcontroller.

No. of Terminals: 48

A higher number of terminals allows for a greater number of connections and peripherals to be interfaced with the microcontroller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good protection for the microcontroller and allows for easy installation on the PCB.

Minimum Supply Voltage: 3 V

Wide range of minimum supply voltage provides flexibility in power supply design to accommodate various system requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the microcontroller suitable for industrial applications where temperature variations can occur.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range allows the microcontroller to operate effectively in cold environments without performance degradation.

ADC Channels: YES

Analog-to-digital converter (ADC) channels allow the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

Quad terminal position provides better stability and reliability for connections compared to other positions.

ROM Words: 32768

Large ROM capacity of 32768 words enables the storage of a significant amount of program and data in the microcontroller.

Maximum Seated Height: 1 mm

Low seated height allows for compact and thin PCB designs, which is beneficial for space-constrained applications.

Width: 6.875 mm

Narrow width of 6.875mm makes the microcontroller suitable for applications where space is limited.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz ensures fast processing speed and performance of the microcontroller.

Length: 6.875 mm

Compact length of 6.875mm allows for easy integration into tight spaces on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the peripheral IC type enhances the microcontroller's performance by simplifying instructions and reducing execution time.

RAM Bytes: 8192

Generous RAM capacity of 8192 bytes allows for efficient data storage and manipulation during program execution.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process and enhances the reliability of the connections.

Maximum Supply Current: 110 mA

Low maximum supply current of 110mA indicates efficient power consumption, making it suitable for battery-powered applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable the microcontroller to generate precise analog output signals, expanding its capabilities for motor control and dimming applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the microcontroller, enhancing flexibility in application development and updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm ensures precise and reliable connections on the PCB, suitable for high-density designs.

Speed: 50 rpm

Speed of 50 rpm indicates fast operation and data processing capabilities of the microcontroller, ensuring quick response times in applications.

No. of I/O Lines: 30

A high number of Input/Output (I/O) lines provides more interfacing options for external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S617-IGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S617-IGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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