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LM3S617-EQN50-C2

Texas Instruments

LM3S617-EQN50-C2 by Texas Instruments

LM3S617-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 0.032 MHz. It features 8192 bytes of RAM and 32768 ROM words, suitable for industrial applications requiring a RISC-based microcontroller with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,348 parts In-Stock

1+ parts

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7,348

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Digiode

USA . 3,952 parts In-Stock

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3,952

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,218 parts In-Stock

1+ parts

$14.800

100+ parts

$14.590

1k+ parts

$14.490

10k+ parts

$14.380

1,218

$14.800

$14.590

$14.490

$14.380

AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$19.674

100+ parts

-

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212

$19.674

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One Stop Electronics

USA . 269 parts In-Stock

1+ parts

$27.000

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269

$27.000

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Parana Technologies

USA . 2,330 parts In-Stock

1+ parts

$28.617

100+ parts

-

1k+ parts

$49.608

10k+ parts

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2,330

$28.617

-

$49.608

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DigiPath Technology Company

USA . 617 parts In-Stock

1+ parts

$31.511

100+ parts

-

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10k+ parts

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617

$31.511

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ChromeModa Solutions

Germany . 3,313 parts In-Stock

1+ parts

$32.154

100+ parts

$26.366

1k+ parts

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3,313

$32.154

$26.366

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IDEA Electronic Components Group

UK . 103 parts In-Stock

1+ parts

$32.154

100+ parts

$30.546

1k+ parts

$28.939

10k+ parts

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103

$32.154

$30.546

$28.939

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Corphita

USA . 1,825 parts In-Stock

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1,825

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Overview

Elevate your projects with the cutting-edge LM3S617-EQN50-C2 microcontroller from Texas Instruments. Crafted with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. With its advanced features and high-quality design, this microcontroller provides unmatched value and benefits to customers looking to take their projects to the next level. Trust in Texas Instruments to deliver excellence in every aspect, from package body material to terminal finish, making the LM3S617-EQN50-C2 the ideal choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can operate efficiently within a safe voltage range.

Package Shape: SQUARE

Square package shape provides easy mounting and integration into circuits and PCB designs.

Bit Size: 32

A 32-bit architecture allows for higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 3.3

A power supply of 3.3V is commonly used and readily available, making it easy to integrate this microcontroller into various applications.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity options for interfacing with peripheral devices and components.

Package Style (Meter): FLATPACK

Flatpack package style saves space and allows for more compact designs in electronics products.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even under lower voltage conditions.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this microcontroller can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows the microcontroller to function in harsh cold environments as well.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, making this microcontroller versatile for a wide range of sensor interfacing applications.

ROM Words: 32768

32768 ROM words provide ample memory space for storing program instructions and data, allowing for complex applications to be implemented.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm saves space in PCB designs and allows for slimmer product profiles.

Width: 7 mm

Compact width of 7mm enables easy integration into narrow spaces and small electronic devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032MHz allows for fast and efficient data processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this microcontroller can be effectively soldered onto PCBs during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and bonding for reliable connections.

Length: 7 mm

Short length of 7mm facilitates space-saving designs and compact layouts in electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environmental conditions and applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and streamlined processing, making this microcontroller suitable for high-performance applications.

RAM Bytes: 8192

With 8192 RAM bytes, this microcontroller can handle large amounts of data and provide smooth multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of this microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections on PCBs during assembly.

Maximum Supply Current: 110 mA

With a maximum supply current of 110mA, this microcontroller operates within a safe current range, preventing overheating and damage.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable voltage input for reliable and consistent performance of the microcontroller.

PWM Channels: YES

Integrated PWM channels enable precise control of output signals, making this microcontroller suitable for applications requiring pulse modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming and updating of firmware, enhancing the flexibility and versatility of this microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packaging and space-efficient layouts on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions to prevent damage.

Speed: 50 rpm

With a speed of 50 RPM, this microcontroller can efficiently process data and execute instructions at a moderate pace suitable for various applications.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller provides ample input/output options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S617-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S617-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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