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LM3S615-IGZ50-C2T

Texas Instruments

LM3S615-IGZ50-C2T by Texas Instruments

Texas Instruments' LM3S615-IGZ50-C2T is a 32-bit microcontroller with 32768 ROM words and 8192 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it features 34 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,128 parts In-Stock

1+ parts

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7,128

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Digiode

USA . 2,196 parts In-Stock

1+ parts

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100+ parts

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2,196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 265 parts In-Stock

1+ parts

$4.000

100+ parts

-

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265

$4.000

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AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$19.731

100+ parts

-

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300

$19.731

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Parana Technologies

USA . 1,871 parts In-Stock

1+ parts

$67.539

100+ parts

$6,271.978

1k+ parts

$60.785

10k+ parts

-

1,871

$67.539

$6,271.978

$60.785

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DigiPath Technology Company

USA . 2,144 parts In-Stock

1+ parts

$74.368

100+ parts

-

1k+ parts

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2,144

$74.368

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ChromeModa Solutions

Germany . 2,139 parts In-Stock

1+ parts

$75.886

100+ parts

$62.227

1k+ parts

-

10k+ parts

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2,139

$75.886

$62.227

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IDEA Electronic Components Group

UK . 658 parts In-Stock

1+ parts

$75.886

100+ parts

$72.092

1k+ parts

$68.297

10k+ parts

-

658

$75.886

$72.092

$68.297

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Microchip USA

USA . 2,058 parts In-Stock

1+ parts

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2,058

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Corphita

USA . 484 parts In-Stock

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484

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Overview

Elevate your projects with the LM3S615-IGZ50-C2T by Texas Instruments, a top-tier microcontroller that sets the standard for quality and performance. With Texas Instruments' renowned reputation for innovation and reliability, this microcontroller offers unmatched value and benefits. Ideal for a wide range of applications, this versatile chip carrier package delivers impeccable precision and efficiency. Experience the advantages of cutting-edge technology without compromising on quality with the LM3S615-IGZ50-C2T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and compact integration into electronic devices, making this microcontroller a convenient choice for small-scale applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile applications and compatibility with various power sources, providing flexibility in design.

Package Shape: SQUARE

The square package shape enables efficient use of space on PCBs, optimizing layout and design considerations for compact electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced processing power and efficiency for handling complex tasks and computations.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common power sources and simplifies the power management aspect of design.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of this microcontroller.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good protection and thermal performance, making it suitable for industrial applications where reliability and heat dissipation are crucial.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and extends the range of compatible power sources, enabling energy-efficient operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand industrial environments and operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C ensures reliability and functionality in extreme temperature environments, making this microcontroller suitable for rugged applications.

ADC Channels: YES

The presence of ADC channels allows for analog signal conversion, enabling the microcontroller to interface with sensors and other analog devices, expanding its applicability.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and assembly, offering ease of integration and enhancing overall design flexibility.

ROM Words: 32768

With a ROM size of 32768 words, this microcontroller has ample memory capacity for storing program instructions and data, supporting complex software algorithms and applications.

Maximum Seated Height: 1 mm

The low maximum seated height facilitates slim and compact designs, making this microcontroller suitable for space-constrained applications where height clearance is limited.

Width: 6.875 mm

The narrow width of 6.875 mm allows for efficient use of space on PCBs, accommodating tight layouts and compact electronic devices.

Maximum Clock Frequency: 0.032 MHz

Operating at a maximum clock frequency of 0.032 MHz, this microcontroller offers moderate processing speed suitable for a wide range of applications, balancing performance and power efficiency.

Length: 6.875 mm

The compact length of 6.875 mm contributes to space-saving design considerations, promoting versatility and flexibility in integrating the microcontroller into electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller offers reliability and robustness in harsh operating conditions commonly found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on a RISC architecture, this microcontroller delivers high performance and efficiency in executing instructions, making it ideal for applications requiring fast and reliable processing.

RAM Bytes: 8192

With a RAM size of 8192 bytes, this microcontroller provides sufficient memory for temporary data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption, fast operation, and high noise immunity, making it a reliable and energy-efficient choice for various applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly and reduces the risk of solder joint cracking, ensuring better reliability and longevity of the microcontroller in electronic systems.

Maximum Supply Current: 110 mA

Operating at a maximum supply current of 110 mA, this microcontroller consumes low power, enhancing energy efficiency and reducing heat dissipation in electronic devices.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent performance, promoting reliable operation and compatibility with standard power sources.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling the microcontroller to drive motors, LEDs, and other devices with variable outputs, enhancing functionality and versatility.

ROM Programmability: FLASH

Featuring flash ROM programmability, this microcontroller offers flexibility in updating firmware and program code, facilitating device customization and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm helps optimize PCB layout and space utilization, enabling compact and efficient designs while ensuring reliable electrical connections.

Speed: 50 rpm

With a speed rating of 50 rpm, this microcontroller delivers moderate processing performance suitable for a wide range of applications, striking a balance between speed and power efficiency.

No. of I/O Lines: 34

Featuring 34 I/O lines, this microcontroller offers versatility in interfacing with external devices and peripherals, providing ample connectivity options for diverse application requirements.

Technical Specifications

Microcontrollers LM3S615-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S615-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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