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LM3S615-IGZ50-C2

Texas Instruments

LM3S615-IGZ50-C2 by Texas Instruments

LM3S615-IGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 32768 ROM words and 8192 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it is ideal for industrial applications requiring ADC channels and PWM functionality. With a package style of CHIP CARRIER and terminal pitch of 0.5 mm, this microcontroller offers high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,582 parts In-Stock

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Vyrian

USA . 3,290 parts In-Stock

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3,290

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Distributors (Availability)

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AZTECH Wire

Italy . 208 parts In-Stock

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$5.442

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$5.442

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One Stop Electronics

USA . 485 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 2,018 parts In-Stock

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$31.712

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$87.358

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$31.712

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DigiPath Technology Company

USA . 1,402 parts In-Stock

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$34.919

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$32.126

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1,402

$34.919

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IDEA Electronic Components Group

UK . 1,271 parts In-Stock

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$35.632

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$33.850

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$32.069

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1,271

$35.632

$33.850

$32.069

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ChromeModa Solutions

Germany . 94 parts In-Stock

1+ parts

$35.632

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$29.218

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Corphita

USA . 2,384 parts In-Stock

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Microchip USA

USA . 2,325 parts In-Stock

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Kepictronics

USA . 62 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S615-IGZ50-C2 microcontroller by Texas Instruments. Manufactured with precision and reliability in mind, this versatile microcontroller is designed to meet your specific application needs. From industrial automation to consumer electronics, this powerful 32-bit device offers seamless integration and exceptional performance. With a wide range of features and capabilities, the LM3S615-IGZ50-C2 provides unmatched value and benefits to customers looking for a cutting-edge solution. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto printed circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is suitable for a wide range of applications without risking damage due to overvoltage.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for applications where space is limited.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processes efficiently.

Power Supplies (V): 3.3

Stable power supply at 3.3 V ensures consistent performance of the microcontroller.

No. of Terminals: 48

With 48 terminals, this microcontroller offers a variety of connection options for peripherals and external devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection for the microcontroller and allows for easy mounting onto PCBs.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable operation even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the microcontroller can function in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making the microcontroller suitable for interfacing with analog sensors and devices.

Terminal Position: QUAD

The quad terminal position provides a balanced layout for connecting external components, enhancing ease of use and connectivity.

ROM Words: 32768

With 32768 ROM words, this microcontroller offers ample storage capacity for program instructions and data.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a slim profile, making this microcontroller suitable for compact designs.

Width: 6.875 mm

The narrow width of 6.875 mm enables the microcontroller to fit into tight spaces, ideal for applications with size constraints.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz allows for fast processing and execution of commands, enhancing overall performance.

Length: 6.875 mm

The compact length of 6.875 mm complements the narrow width, contributing to the microcontroller's space-saving design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in rugged industrial environments, making this microcontroller a robust choice for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high performance and efficiency, suitable for a wide range of applications that require fast processing.

RAM Bytes: 8192

With 8192 RAM bytes, this microcontroller provides sufficient memory for storing and manipulating data during program execution.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high noise immunity, contributing to reliable and efficient operation.

Terminal Form: NO LEAD

The no lead terminal form simplifies the soldering process during assembly, making it easier to integrate the microcontroller onto PCBs.

Maximum Supply Current: 110 mA

With a maximum supply current of 110 mA, this microcontroller operates efficiently without drawing excessive power, making it energy-efficient.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures stability and compatibility with standard power sources, contributing to reliable performance.

PWM Channels: YES

The presence of PWM channels allows for precise control of digital signals, making the microcontroller suitable for applications that require modulation and control of power levels.

ROM Programmability: FLASH

The flash ROM programmability allows for reprogramming of the microcontroller, enabling flexibility in updating firmware and implementing changes as needed.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting of the microcontroller, making it suitable for compact designs with limited space.

Speed: 50 rpm

With a speed of 50 rpm, this microcontroller can process commands and data at a fast rate, enhancing overall performance and responsiveness.

No. of I/O Lines: 34

With 34 I/O lines, this microcontroller offers sufficient input and output options for connecting external devices and peripherals, enhancing versatility and connectivity.

Technical Specifications

Microcontrollers LM3S615-IGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S615-IGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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