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LM3S615-EGZ50-C2

Texas Instruments

LM3S615-EGZ50-C2 by Texas Instruments

LM3S615-EGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 32768 ROM words and 8192 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it is ideal for industrial applications requiring PWM channels and ADC functionality. With a package style of CHIP CARRIER and terminal pitch of 0.5 mm, this microcontroller offers high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,693 parts In-Stock

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Vyrian

USA . 189 parts In-Stock

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189

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Distributors (Availability)

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AZTECH Wire

Italy . 726 parts In-Stock

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$7.352

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726

$7.352

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One Stop Electronics

USA . 715 parts In-Stock

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$25.000

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715

$25.000

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Parana Technologies

USA . 618 parts In-Stock

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$62.214

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618

$62.214

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DigiPath Technology Company

USA . 14 parts In-Stock

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$68.505

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$63.025

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14

$68.505

$63.025

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ChromeModa Solutions

Germany . 3,170 parts In-Stock

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$69.903

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$57.320

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3,170

$69.903

$57.320

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IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$69.903

100+ parts

$66.408

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$62.913

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1,092

$69.903

$66.408

$62.913

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Microchip USA

USA . 2,900 parts In-Stock

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Corphita

USA . 633 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S615-EGZ50-C2 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device offers a wide range of applications in various industries. From industrial automation to consumer electronics, the LM3S615-EGZ50-C2 delivers unmatched performance and efficiency. Experience seamless integration and innovative solutions with this top-of-the-line product, setting new standards for quality and value. Elevate your projects with Texas Instruments' expertise and trust in the LM3S615-EGZ50-C2 for unparalleled success.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in design options.

Package Shape: SQUARE

Square packages are easier to handle and place on a PCB, simplifying the manufacturing process.

Bit Size: 32

32-bit architecture allows for faster processing and handling of data compared to lower bit sizes.

Power Supplies (V): 3.3

Can operate efficiently at standard voltage levels, ensuring compatibility with a wide range of systems.

No. of Terminals: 48

Sufficient number of terminals for connecting to various components and peripherals, making it versatile in applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good heat dissipation and mechanical protection to the microcontroller.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial environments or applications that generate heat.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, making it suitable for a wide range of environments.

ADC Channels: YES

Integrated analog-to-digital converter channels allow for sensor interfacing and analog signal processing.

Terminal Position: QUAD

Quad terminal position provides better mechanical stability and simplifies PCB layout for connections.

ROM Words: 32768

Large ROM capacity allows for storing complex programs and data, supporting a wide range of applications.

Maximum Seated Height: 1 mm

Low profile design with a small seated height enables compact and slim device designs.

Width: 6.875 mm

Compact width dimensions save space on the PCB, allowing for more components or features in the design.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency allows for fast execution of instructions, improving overall performance.

Length: 6.875 mm

Compact length dimensions save space on the PCB, enabling smaller form factor devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with extreme temperatures and conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture delivers efficient performance for handling complex instructions and operations.

RAM Bytes: 8192

Adequate RAM capacity for temporary data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of lead contamination.

Maximum Supply Current: 110 mA

Capable of providing sufficient current to drive various peripherals and components without overload.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Pulse width modulation (PWM) channels enable precise control of output signals, ideal for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM allows for easy and fast programming of the microcontroller, facilitating firmware updates and alterations.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables higher density PCB designs, accommodating more connections in a limited space.

Speed: 50 rpm

Capable of processing data and executing instructions at a speed of 50 rotations per minute, suitable for a wide range of applications.

No. of I/O Lines: 34

Sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers LM3S615-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S615-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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