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LM3S613-IGZ50-C2T

Texas Instruments

LM3S613-IGZ50-C2T by Texas Instruments

LM3S613-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 32 I/O lines, 8192 bytes of RAM, and 32768 ROM words. It operates at a max clock frequency of 0.032 MHz and is ideal for industrial applications requiring a powerful Cortex-M3 CPU with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,251 parts In-Stock

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Digiode

USA . 2,897 parts In-Stock

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2,897

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Distributors (Availability)

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One Stop Electronics

USA . 873 parts In-Stock

1+ parts

$14.000

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873

$14.000

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AZTECH Wire

Italy . 667 parts In-Stock

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$15.102

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667

$15.102

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Parana Technologies

USA . 1,854 parts In-Stock

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$22.691

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$23.354

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$22.691

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$23.354

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DigiPath Technology Company

USA . 2,327 parts In-Stock

1+ parts

$24.986

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$22.987

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2,327

$24.986

$22.987

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ChromeModa Solutions

Germany . 5,807 parts In-Stock

1+ parts

$25.496

100+ parts

$20.907

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5,807

$25.496

$20.907

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$25.496

100+ parts

$24.221

1k+ parts

$22.946

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1,703

$25.496

$24.221

$22.946

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Corphita

USA . 4,573 parts In-Stock

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Microchip USA

USA . 1,796 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the LM3S613-IGZ50-C2T microcontroller by Texas Instruments. As a leader in innovation and quality, Texas Instruments delivers top-notch performance and reliability. Ideal for a wide range of applications, this microcontroller offers unmatched value, efficiency, and flexibility. With its cutting-edge technology and advanced features, the LM3S613-IGZ50-C2T is the perfect choice for customers looking to take their projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and reliable for long-term use.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microcontroller into various electronic designs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power options.

Package Shape: SQUARE

Square package shape helps in easy placement on PCBs and efficient use of board space.

Bit Size: 32

32-bit architecture provides efficient processing capabilities for complex applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the microcontroller.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced protection and durability for the microcontroller.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures operation even in low power conditions.

Maximum Operating Temperature: 85 °C

Operates efficiently at high temperatures, making it suitable for industrial applications.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family provides high-performance computing capabilities for demanding tasks.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for various environments.

ADC Channels: YES

Integrated ADC channels enable analog signal processing for sensor interfacing.

Terminal Position: QUAD

Quad terminal configuration simplifies PCB layout and connection setup.

ROM Words: 32768

With 32768 ROM words, the microcontroller can store a large amount of program data.

Maximum Seated Height: 1 mm

Low seated height allows for compact design solutions in space-constrained applications.

Width: 6.875 mm

Narrow width enables space-efficient placement on PCBs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency of 0.032 MHz enables fast processing speeds for real-time applications.

Length: 6.875 mm

Compact length facilitates compact PCB designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature handling ensures reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the peripheral IC type provides efficient and optimized processing capabilities.

RAM Bytes: 8192

With 8192 RAM bytes, the microcontroller can handle data storage and processing efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: NO LEAD

No-lead terminal form simplifies the soldering process during assembly.

Maximum Supply Current: 110 mA

With a maximum supply current of 110 mA, the microcontroller operates efficiently without overloading power sources.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable operation under normal conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs for motor or LED control.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density PCB designs and efficient board routing.

Speed: 50 rpm

Operating speed of 50 rpm ensures fast processing and response times.

No. of I/O Lines: 32

32 I/O lines provide ample connectivity options for interfacing with external devices and components.

Technical Specifications

Microcontrollers LM3S613-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S613-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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