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LM3S611-IGZ50-C2

Texas Instruments

LM3S611-IGZ50-C2 by Texas Instruments

LM3S611-IGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 32KB ROM, and 8KB RAM. It operates in industrial temperature range (-40 to 85°C) and features Cortex-M3 CPU family. Ideal for applications requiring high-speed processing and ADC channels for data acquisition.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,032 parts In-Stock

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7,032

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Digiode

USA . 4,633 parts In-Stock

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4,633

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Distributors (Availability)

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AZTECH Wire

Italy . 641 parts In-Stock

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$17.195

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641

$17.195

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One Stop Electronics

USA . 1,638 parts In-Stock

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$27.000

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$27.000

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Parana Technologies

USA . 1,152 parts In-Stock

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$27.886

100+ parts

$2,589.672

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$25.098

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1,152

$27.886

$2,589.672

$25.098

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DigiPath Technology Company

USA . 2,276 parts In-Stock

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$30.706

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2,276

$30.706

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ChromeModa Solutions

Germany . 5,884 parts In-Stock

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$31.333

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$25.693

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$31.333

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IDEA Electronic Components Group

UK . 424 parts In-Stock

1+ parts

$31.333

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$29.766

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$28.200

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424

$31.333

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Corphita

USA . 4,212 parts In-Stock

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Microchip USA

USA . 2,464 parts In-Stock

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Kepictronics

USA . 59 parts In-Stock

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Overview

Elevate your projects with the LM3S611-IGZ50-C2 microcontroller from Texas Instruments. As a leading manufacturer in the industry, TI delivers top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering unmatched value to customers. With its 32-bit architecture and advanced features, this chip is versatile and powerful. Whether you're working on IoT devices, robotics, or industrial automation, the LM3S611-IGZ50-C2 is sure to exceed your expectations. Experience the benefits of cutting-edge technology and unleash your creativity with this exceptional product.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly, making this microcontroller suitable for small and portable devices.

Maximum Supply Voltage: 3.6 V

Higher supply voltage provides flexibility in power input options and can support a wider range of components in the circuit.

Package Shape: SQUARE

Square package shape is easy to handle and integrate into circuit designs, offering a balanced layout for efficient PCB design.

Bit Size: 32

32-bit architecture allows for faster processing and higher computational capabilities compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance and compatibility with common voltage standards in electronic devices.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample input/output options for connecting various sensors and peripherals, enhancing its versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers durability and protection for the integrated circuit, ensuring longevity and reliability in challenging environments.

Minimum Supply Voltage: 3 V

Having a minimum supply voltage of 3V ensures compatibility with a wide range of power sources and prevents potential voltage drop issues.

Maximum Operating Temperature: 85 °C

Operates effectively in high-temperature environments, making it suitable for industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and energy efficiency, making this microcontroller ideal for power-sensitive applications without compromising on speed.

Minimum Operating Temperature: -40 °C

Capable of functioning at extremely low temperatures, making it suitable for outdoor or harsh environments where temperature drops significantly.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate conversion of analog signals into digital data, enabling precise sensor readings and measurements.

Terminal Position: QUAD

Quad terminal position provides a balanced layout for easy soldering and component placement, enhancing the overall reliability and durability of the device.

ROM Words: 32768

With 32768 ROM words, this microcontroller offers ample memory capacity for storing program instructions, data, and firmware updates.

Maximum Seated Height: 1 mm

Low seated height enables compact and slim device designs, making it suitable for applications where space constraints are a priority.

Width: 6.875 mm

Compact width allows for efficient PCB layout and integration into small form factor devices, making it ideal for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz enables fast data processing and real-time operation, making it suitable for time-critical applications.

Length: 6.875 mm

Optimal length for compact and streamlined device designs, ensuring efficient use of space without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers improved performance and efficiency, making this microcontroller suitable for applications requiring fast data processing and low power consumption.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes allows for efficient data storage and manipulation, enhancing the overall performance and responsiveness of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

No-lead terminal form provides better electrical performance and thermal characteristics, ensuring reliable connectivity and stable operation.

Maximum Supply Current: 110 mA

With a maximum supply current of 110 mA, this microcontroller offers efficient power management and low power consumption, extending battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard voltage levels in electronic devices.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of connected devices and peripherals, enabling accurate voltage regulation and motor speed control.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for firmware updates and reprogramming, ensuring easy maintenance and future-proofing of the device.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables compact PCB design and efficient soldering, making it suitable for high-density applications with limited space.

Speed: 50 rpm

Capable of handling speeds up to 50 rpm, making it suitable for applications requiring precise speed control and motor rotation functionality.

No. of I/O Lines: 32

With 32 input/output lines, this microcontroller offers ample connectivity options for interfacing with external sensors, actuators, and communication devices.

Technical Specifications

Microcontrollers LM3S611-IGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S611-IGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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