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LM3S610-IQN50-C2T

Texas Instruments

LM3S610-IQN50-C2T by Texas Instruments

LM3S610-IQN50-C2T by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 48 terminals, and Cortex-M3 CPU family. It operates b/w -40 to 85°C and features 8192 bytes of RAM, FLASH ROM programmability, and PWM channels. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,256 parts In-Stock

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Digiode

USA . 579 parts In-Stock

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AZTECH Wire

Italy . 501 parts In-Stock

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$8.443

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One Stop Electronics

USA . 258 parts In-Stock

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$21.000

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Microchip USA

USA . 3,620 parts In-Stock

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$25.790

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$25.630

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$25.550

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Parana Technologies

USA . 131 parts In-Stock

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$51.879

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ChromeModa Solutions

Germany . 3,969 parts In-Stock

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$58.291

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$47.799

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IDEA Electronic Components Group

UK . 1,358 parts In-Stock

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$58.291

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$55.376

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$52.462

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QUARKTWIN TECHNOLOGY LTD

USA . 9,540 parts In-Stock

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DigiPath Technology Company

USA . 1,809 parts In-Stock

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Corphita

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Overview

Unlock the power of innovation with the LM3S610-IQN50-C2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. With advanced features and cutting-edge technology, customers can trust in the value and benefits this product brings to their projects. Experience the difference with the LM3S610-IQN50-C2T and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring longevity and ease of handling during installation.

Surface Mount: YES

Facilitates easy and efficient installation onto circuit boards, saving time and effort in the assembly process.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, providing flexibility in power supply options.

Bit Size: 32

High bit size allows for complex computations and processing capabilities, suitable for a variety of applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the microcontroller.

No. of Terminals: 48

Sufficient number of terminals for versatile connectivity options with other components.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to interface with analog sensors and signals.

ROM Words: 32768

Large ROM capacity allows for storing program instructions and data, accommodating complex algorithms and applications.

CPU Family: CORTEX-M3

Part of the efficient and powerful Cortex-M3 CPU family, ensuring high performance and reliability in processing tasks.

RAM Bytes: 8192

Adequate RAM size for storing temporary data and variables during program execution, enhancing processing speed and efficiency.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast execution of instructions, making the microcontroller suitable for time-sensitive applications.

Temperature Grade: INDUSTRIAL

Operates reliably in industrial temperature ranges, ensuring performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and integrated peripherals make it well-suited for embedded control applications, offering efficient processing and interfacing capabilities.

Technical Specifications

Microcontrollers LM3S610-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S610-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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