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LM3S610-IGZ50-C2T

Texas Instruments

LM3S610-IGZ50-C2T by Texas Instruments

LM3S610-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 32 MHz. It operates in industrial temperature range (-40 to 85 °C) and features 8192 bytes of RAM. Ideal for applications requiring high-speed processing and precise control, such as industrial automation systems or IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,285 parts In-Stock

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7,285

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Digiode

USA . 135 parts In-Stock

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135

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Distributors (Availability)

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$6.102

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559

$6.102

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One Stop Electronics

USA . 1,066 parts In-Stock

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$16.000

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1,066

$16.000

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Parana Technologies

USA . 2,287 parts In-Stock

1+ parts

$51.420

100+ parts

$4,775.104

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$46.278

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2,287

$51.420

$4,775.104

$46.278

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DigiPath Technology Company

USA . 2,053 parts In-Stock

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$56.620

100+ parts

$52.090

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2,053

$56.620

$52.090

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ChromeModa Solutions

Germany . 4,450 parts In-Stock

1+ parts

$57.775

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$47.376

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4,450

$57.775

$47.376

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IDEA Electronic Components Group

UK . 219 parts In-Stock

1+ parts

$57.775

100+ parts

$54.886

1k+ parts

$51.998

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219

$57.775

$54.886

$51.998

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Corphita

USA . 3,193 parts In-Stock

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Microchip USA

USA . 2,775 parts In-Stock

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2,775

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Overview

Unlock the power of innovation with the LM3S610-IGZ50-C2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering unmatched performance and versatility. Experience seamless integration and enhanced functionality with this cutting-edge product. Trust Texas Instruments to deliver value, benefits, and advantages that will take your projects to the next level. Elevate your designs with the LM3S610-IGZ50-C2T today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy integration into PCB designs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square package shape provides a uniform footprint for consistent PCB layout and design.

Bit Size: 32

32-bit architecture offers high computational capabilities and performance for a microcontroller.

Power Supplies (V): 3.3

Efficient power supply at 3.3V for optimal performance and energy efficiency.

No. of Terminals: 48

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a compact and durable housing for the microcontroller.

Minimum Supply Voltage: 3 V

Wide range of supply voltage support ensures stability in different operating conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes it suitable for industrial applications with demanding environments.

CPU Family: CORTEX-M3

Utilizes the powerful ARM Cortex-M3 architecture for efficient processing and performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation even in extreme cold conditions.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, expanding the microcontroller's versatility.

Terminal Position: QUAD

Quad terminal position offers flexibility in connecting external components and devices.

ROM Words: 32768

Ample ROM storage capacity of 32768 words for program storage and data retention.

Maximum Seated Height: 1 mm

Low seated height allows for slim and compact designs in space-constrained applications.

Width: 6.875 mm

Compact width dimension for easy integration into various PCB layouts and configurations.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32 MHz for fast processing and response times.

Length: 6.875 mm

Optimal length dimension for a balanced form factor in PCB designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller with various peripheral ICs for enhanced functionality and connectivity.

RAM Bytes: 8192

Sufficient RAM storage of 8192 bytes for data processing and temporary storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

Non-leaded terminal form for easy soldering and connection in surface mount applications.

Maximum Supply Current: 110 mA

Low maximum supply current of 110 mA for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V for consistent and reliable performance.

PWM Channels: YES

Integrated PWM channels for precise control of analog signals and devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast updates to the microcontroller's firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm for compact and precise connections in PCB designs.

Speed: 50 rpm

Operates at a speed of 50 revolutions per minute, suitable for various motor control applications.

No. of I/O Lines: 34

Sufficient number of I/O lines for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers LM3S610-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S610-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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