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LM3S608-IQN50-C2T

Texas Instruments

LM3S608-IQN50-C2T by Texas Instruments

LM3S608-IQN50-C2T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 8KB RAM, and 32768 ROM words. It features 8-channel ADC, 3 timers, and PWM channels for applications requiring industrial-grade performance in a compact package. With I2C, SSI, and UART connectivity options, it's ideal for embedded systems needing low power consumption at up to 0.032 MHz clock frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ComSIT USA

USA . 3,300 parts In-Stock

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3,300

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Chip Stock

USA . 3,046 parts In-Stock

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3,046

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Digiode

USA . 2,680 parts In-Stock

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2,680

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Vyrian

USA . 2,229 parts In-Stock

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2,229

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

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$10.720

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271

$10.720

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Microchip USA

USA . 148 parts In-Stock

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$22.010

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$21.850

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$21.850

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$21.690

148

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$21.850

$21.690

One Stop Electronics

USA . 1,572 parts In-Stock

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$30.000

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$30.000

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Parana Technologies

USA . 1,772 parts In-Stock

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$45.718

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1,772

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DigiPath Technology Company

USA . 818 parts In-Stock

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$50.342

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818

$50.342

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ChromeModa Solutions

Germany . 5,993 parts In-Stock

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$51.369

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$42.123

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$51.369

$42.123

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IDEA Electronic Components Group

UK . 1,836 parts In-Stock

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$51.369

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$48.801

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$46.232

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1,836

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$46.232

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Kepictronics

USA . 5,763 parts In-Stock

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Perfect Parts

USA . 4,357 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,226 parts In-Stock

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Overview

Experience the cutting-edge technology of the Texas Instruments LM3S608-IQN50-C2T microcontroller. Designed with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. With advanced features like integrated cache, ADC channels, and PWM channels, this versatile product provides customers with exceptional value and flexibility. Whether you're working on industrial automation, consumer electronics, or IoT devices, the LM3S608-IQN50-C2T delivers superior results every time. Trust in Texas Instruments to bring you the best in microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring longevity and reliability in various applications.

Integrated Cache: YES

Integrated cache helps improve performance by storing frequently accessed data, reducing access times and enhancing overall efficiency of the microcontroller.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can support a wide range of external components and peripherals, making it versatile for different projects.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 CPU family ensures high performance, low power consumption, and efficient processing capabilities, making it a reliable choice for embedded systems.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, making it suitable for applications that require analog-to-digital conversion.

ROM Programmability: FLASH

The flash ROM programmability feature enables users to easily reprogram the microcontroller, facilitating firmware updates and customization without the need for external programming tools.

Technical Specifications

Microcontrollers LM3S608-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

28

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S608-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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