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LM3S608-IGZ50-C2

Texas Instruments

LM3S608-IGZ50-C2 by Texas Instruments

LM3S608-IGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 48 terminals, and Cortex-M3 CPU family. It operates b/w -40 to 85°C, suitable for industrial applications requiring ADC channels, PWM channels, and 8192 bytes of RAM. With a clock frequency of 0.032 MHz and flash ROM programmability, it offers high performance in compact square chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,810 parts In-Stock

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Vyrian

USA . 4,546 parts In-Stock

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AZTECH Wire

Italy . 382 parts In-Stock

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$12.314

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One Stop Electronics

USA . 1,303 parts In-Stock

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$20.000

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Parana Technologies

USA . 857 parts In-Stock

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$42.142

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DigiPath Technology Company

USA . 1,275 parts In-Stock

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$46.404

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ChromeModa Solutions

Germany . 4,377 parts In-Stock

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$47.351

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$38.828

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IDEA Electronic Components Group

UK . 184 parts In-Stock

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$47.351

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$44.983

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$42.616

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Lixinc

USA . 7,773 parts In-Stock

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Corphita

USA . 3,337 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Unlock the power of innovation with the LM3S608-IGZ50-C2 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers high-quality products that redefine possibilities. This versatile microcontroller is suitable for a wide range of applications, offering customers unmatched value and performance. Experience seamless integration, reliable operation, and enhanced functionality with the LM3S608-IGZ50-C2. Join the Texas Instruments family and revolutionize your projects today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range, offering flexibility in power supply options.

Package Shape: SQUARE

Square packages are typically more space-efficient and easier to handle during assembly and soldering.

Bit Size: 32

Higher bit size allows for better processing capabilities and handling of complex operations.

Power Supplies (V): 3.3

Matches standard power supply voltages, ensuring compatibility with commonly available power sources.

No. of Terminals: 48

Provides a sufficient number of connections for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal performance and protection for the integrated circuit inside.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower supply voltages, improving robustness in various operating conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high operating temperatures, enhancing the product's reliability and durability.

CPU Family: CORTEX-M3

Part of a proven and widely used CPU family known for its efficiency and performance in embedded systems.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold conditions, making it suitable for a wide range of applications and environments.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to read and process analog signals, expanding its functionality.

Terminal Position: QUAD

Quad terminal configuration facilitates easy connections and reduces the chances of misalignment or errors during installation.

ROM Words: 32768

Ample ROM capacity allows for storing program code and data, supporting complex applications and algorithms.

Maximum Seated Height: 1 mm

Low profile design helps in creating sleek and compact device designs, suitable for space-constrained applications.

Width: 6.875 mm

Compact width dimension enables integration in narrow spaces, enhancing the product's versatility in diverse applications.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast processing of instructions and tasks, improving overall performance.

Length: 6.875 mm

Compact length dimension facilitates fitting the microcontroller in small form factor devices, enhancing portability and versatility.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings with varying temperature conditions, ensuring durability and longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient processing and execution of instructions, enhancing overall system performance.

RAM Bytes: 8192

Sufficient RAM capacity for storing and accessing data during program execution, supporting multitasking and complex computations.

Technology: CMOS

CMOS technology provides low power consumption, making the microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability and signal integrity, reducing the risk of solder joint fatigue and ensuring long-term performance.

Maximum Supply Current: 110 mA

Moderate supply current requirement for optimal operation and efficient power consumption, suitable for various applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation, maintaining performance over the product's lifespan.

PWM Channels: YES

PWM channels enable precise control of analog signals, supporting applications such as motor control, lighting, and power management.

ROM Programmability: FLASH

Flash ROM enables easy and flexible programming of the microcontroller, allowing for quick updates and customization of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, maximizing space efficiency and facilitating compact designs.

Speed: 50 rpm

Operates at a speed of 50 rotations per minute, suitable for control applications requiring precise and consistent rotational speeds.

No. of I/O Lines: 28

Adequate number of input/output lines for interfacing with external devices and peripherals, enhancing the microcontroller's connectivity and versatility.

Technical Specifications

Microcontrollers LM3S608-IGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S608-IGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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