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LM3S601-IGZ50-C2T

Texas Instruments

LM3S601-IGZ50-C2T by Texas Instruments

LM3S601-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 48 terminals, and 32768 ROM words. It operates b/w -40 to 85 °C and features a Cortex-M3 CPU family. Ideal for industrial applications requiring high-speed processing and multiple PWM channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,574 parts In-Stock

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Vyrian

USA . 3,282 parts In-Stock

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3,282

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Distributors (Availability)

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AZTECH Wire

Italy . 407 parts In-Stock

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$11.247

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407

$11.247

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One Stop Electronics

USA . 1,635 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 1,112 parts In-Stock

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$15.980

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$16.324

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$15.980

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DigiPath Technology Company

USA . 1,067 parts In-Stock

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$17.596

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1,067

$17.596

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ChromeModa Solutions

Germany . 4,424 parts In-Stock

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$17.955

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$14.723

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$17.955

$14.723

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IDEA Electronic Components Group

UK . 264 parts In-Stock

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$17.955

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$17.057

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$16.160

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264

$17.955

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$16.160

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Corphita

USA . 2,139 parts In-Stock

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Microchip USA

USA . 1,642 parts In-Stock

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Overview

Discover the LM3S601-IGZ50-C2T by Texas Instruments, a top-of-the-line microcontroller that combines cutting-edge technology with unmatched reliability. Designed to meet the demands of industrial applications, this powerful chip carrier is perfect for projects requiring high-speed performance and advanced functionality. With features like 32-bit processing, multiple ADC channels, and PWM capabilities, this microcontroller offers endless possibilities for innovation. Trust in Texas Instruments' reputation for quality and dependability, and unlock the full potential of your next project with the LM3S601-IGZ50-C2T.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount on PCBs, optimizing board layout.

Bit Size: 32

32-bit architecture provides high computational power and performance for demanding tasks.

Power Supplies (V): 3.3

A common and stable power supply voltage ensuring reliability in operation.

No. of Terminals: 48

Sufficient number of terminals for connecting peripherals and external components, enhancing functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal performance and protection, essential for reliable operation.

Minimum Supply Voltage: 3 V

Supports low supply voltages for energy-efficient operation in battery-powered applications.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial and automotive applications.

CPU Family: CORTEX-M3

A well-known and widely used CPU family known for its performance and efficiency.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments without compromising performance.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, essential for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position allows for efficient layout and connection on the PCB, saving space and simplifying routing.

ROM Words: 32768

Ample ROM size for program storage, enabling complex algorithms and functions to be implemented.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications, enabling compact and sleek product designs.

Width: 6.875 mm

Compact width dimension for flexibility in board layout and integration in small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing and real-time application requirements.

Length: 6.875 mm

Balanced length dimension for efficient PCB mounting and compatibility with standard board sizes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for optimized performance and efficiency in handling various tasks and peripherals.

RAM Bytes: 8192

Sufficient RAM size for data storage and processing, enabling multitasking and complex computations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: NO LEAD

No lead terminal form for lead-free soldering processes, complying with environmental regulations.

Maximum Supply Current: 110 mA

Low supply current for power efficiency and reduced heat generation, prolonging the product's lifespan.

Nominal Supply Voltage: 3.3 V

Stable and optimized supply voltage for consistent and reliable performance of the microcontroller.

PWM Channels: YES

Built-in PWM channels for precise analog signal modulation and control, essential for motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM type allows for flexible and easy program updates, simplifying firmware development and maintenance.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density connectivity, enabling compact and feature-rich PCB designs.

Speed: 50 rpm

High processing speed for quick response times in real-time applications, enhancing overall system performance.

No. of I/O Lines: 36

Sufficient number of I/O lines for interfacing and communication with external devices, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers LM3S601-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S601-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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