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LM3S601-EGZ50-C2

Texas Instruments

LM3S601-EGZ50-C2 by Texas Instruments

Texas Instruments' LM3S601-EGZ50-C2 is a 32-bit microcontroller with 3.3V power supply, operating b/w -40 to 105 °C. Featuring 36 I/O lines, 8192 bytes of RAM, and FLASH ROM programmability, it's ideal for industrial applications requiring high-speed processing and ADC channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,977 parts In-Stock

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Digiode

USA . 1,051 parts In-Stock

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1,051

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Distributors (Availability)

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AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$8.475

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612

$8.475

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One Stop Electronics

USA . 675 parts In-Stock

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$9.000

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675

$9.000

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Parana Technologies

USA . 350 parts In-Stock

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$65.162

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350

$65.162

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DigiPath Technology Company

USA . 363 parts In-Stock

1+ parts

$71.752

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$66.012

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363

$71.752

$66.012

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IDEA Electronic Components Group

UK . 2,250 parts In-Stock

1+ parts

$73.216

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$69.555

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$65.894

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2,250

$73.216

$69.555

$65.894

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ChromeModa Solutions

Germany . 529 parts In-Stock

1+ parts

$73.216

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$60.037

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529

$73.216

$60.037

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Microchip USA

USA . 1,212 parts In-Stock

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Corphita

USA . 1,094 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S601-EGZ50-C2 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this device offers a wide range of applications for various industries. From industrial automation to consumer electronics, this chip carrier package brings a seamless integration of advanced features and high performance. Experience the advantage of a 32-bit Cortex-M3 CPU family, along with 36 I/O lines and 8192 bytes of RAM. Elevate your projects with the quality and innovation that only Texas Instruments can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capabilities make this microcontroller easy to integrate into modern electronic designs and PCB layouts.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power input levels, providing versatility in different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, making this microcontroller suitable for compact designs.

Bit Size: 32

32-bit architecture enables faster processing and improved performance for complex applications compared to lower bit sizes.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation and compatibility with common voltage standards in electronics.

No. of Terminals: 48

High number of terminals provides ample connectivity options for peripherals, sensors, and other components in a project.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced thermal performance and easy soldering, contributing to the overall reliability of the microcontroller.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures that the microcontroller can operate effectively even under low-power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows for reliable operation even in harsh environmental conditions.

CPU Family: CORTEX-M3

Belonging to the CORTEX-M3 family ensures compatibility with a wide range of software development tools and libraries, simplifying the programming process.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C makes this microcontroller suitable for use in a variety of industrial and outdoor applications.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making this microcontroller ideal for applications requiring sensor data acquisition.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and soldering, enhancing the overall manufacturability of the product.

ROM Words: 32768

Large ROM capacity of 32768 words provides ample storage for program code and data, supporting complex firmware requirements.

Maximum Seated Height: 1 mm

Low seated height of 1mm enables compact device designs, allowing for efficient use of space in electronic products.

Width: 6.875 mm

Narrow width of 6.875mm makes this microcontroller suitable for applications with space constraints, such as wearable devices or IoT modules.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32 MHz enables fast data processing and responsiveness, enhancing the overall performance of the microcontroller.

Length: 6.875 mm

Compact length of 6.875mm further contributes to space efficiency in electronic designs, ensuring versatility in product integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in demanding environments, making this microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the peripheral IC type offers efficient data processing and low power consumption, enhancing the energy efficiency of the microcontroller.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes allows for efficient data storage and manipulation, supporting multitasking and complex algorithms in applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to the overall energy efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process and enhances the mechanical durability of the microcontroller, ensuring long-term reliability.

Maximum Supply Current: 110 mA

Maximum supply current of 110mA ensures efficient power usage and prevents overloading, contributing to the overall stability of the microcontroller.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with common power sources, simplifying integration into electronic systems.

PWM Channels: YES

Integrated PWM channels enable precise control of digital signals, making this microcontroller suitable for applications requiring motor control or LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing the flexibility and longevity of the microcontroller.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm enables high-density PCB layouts and compact device designs, making this microcontroller ideal for miniaturized products.

Speed: 50 rpm

With a speed rating of 50 rpm, this microcontroller can quickly process data and respond to inputs, suitable for applications requiring real-time operation.

No. of I/O Lines: 36

High number of I/O lines provides ample connectivity options for interfacing with external devices, sensors, and communication modules, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S601-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S601-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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