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LM3S5U91-IQC80-A2T

Texas Instruments

LM3S5U91-IQC80-A2T by Texas Instruments

LM3S5U91-IQC80-A2T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 393216 ROM words, and 98304 RAM bytes. It operates at up to 16.384 MHz clock frequency and has ADC, DMA, and PWM channels for industrial applications requiring high-speed processing and precise control. With a compact square package style of 14mm x 14mm and low profile height of 1.6mm, it is suitable for space-constrained designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,286 parts In-Stock

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4,286

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Vyrian

USA . 2,743 parts In-Stock

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2,743

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

1+ parts

$6.313

100+ parts

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550

$6.313

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One Stop Electronics

USA . 1,321 parts In-Stock

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$22.000

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1,321

$22.000

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Parana Technologies

USA . 2,238 parts In-Stock

1+ parts

$73.583

100+ parts

$6,833.254

1k+ parts

$66.224

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2,238

$73.583

$6,833.254

$66.224

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DigiPath Technology Company

USA . 1,199 parts In-Stock

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$81.023

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1,199

$81.023

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ChromeModa Solutions

Germany . 5,880 parts In-Stock

1+ parts

$82.677

100+ parts

$67.795

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5,880

$82.677

$67.795

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IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$82.677

100+ parts

$78.543

1k+ parts

$74.409

10k+ parts

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919

$82.677

$78.543

$74.409

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Corphita

USA . 4,694 parts In-Stock

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4,694

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Microchip USA

USA . 267 parts In-Stock

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267

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Overview

Unleash the power of innovation with the LM3S5U91-IQC80-A2T from Texas Instruments. This top-of-the-line microcontroller offers unparalleled quality and reliability, making it the go-to choice for a wide range of applications. With its advanced features and cutting-edge technology, this product provides customers with exceptional value, benefits, and advantages. Trust in Texas Instruments to deliver excellence in every aspect, and experience the difference with the LM3S5U91-IQC80-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 1.365 V

Lower maximum supply voltage can help in reducing power consumption and increasing overall efficiency of the device.

Bit Size: 32

The 32-bit architecture provides higher processing capabilities and performance compared to lower bit size microcontrollers.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options and interface capabilities with other components.

ROM Words: 393216

Large ROM size allows for storing a significant amount of program and data, enabling complex applications to be run on the device.

RAM Bytes: 98304

Ample RAM capacity enables efficient data processing and storage, essential for handling multiple tasks simultaneously.

Maximum Clock Frequency: 16.384 MHz

Higher clock frequency enables faster data processing and execution of instructions, improving overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances speed and efficiency of the microcontroller, making it a reliable choice for various applications.

Maximum Supply Current: 135 mA

Lower supply current consumption helps in reducing power usage and heat dissipation, contributing to energy efficiency.

Technical Specifications

Microcontrollers LM3S5U91-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5U91-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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