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LM3S5U91-IQC80-A2

Texas Instruments

LM3S5U91-IQC80-A2 by Texas Instruments

LM3S5U91-IQC80-A2 by Texas Instruments is a 32-bit Cortex-M3 microcontroller with 393216 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it suitable for industrial applications requiring high-speed processing and extensive memory capabilities. With features like ADC and DMA channels, this microcontroller offers versatile functionality for various embedded systems projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,321 parts In-Stock

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3,321

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Vyrian

USA . 2,146 parts In-Stock

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2,146

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Distributors (Availability)

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One Stop Electronics

USA . 126 parts In-Stock

1+ parts

$3.000

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126

$3.000

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AZTECH Wire

Italy . 564 parts In-Stock

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$10.313

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564

$10.313

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Parana Technologies

USA . 1,953 parts In-Stock

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$25.900

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$26.499

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1,953

$25.900

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$26.499

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DigiPath Technology Company

USA . 1,574 parts In-Stock

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$28.519

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1,574

$28.519

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ChromeModa Solutions

Germany . 5,993 parts In-Stock

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$29.101

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$23.863

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5,993

$29.101

$23.863

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IDEA Electronic Components Group

UK . 82 parts In-Stock

1+ parts

$29.101

100+ parts

$27.646

1k+ parts

$26.191

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82

$29.101

$27.646

$26.191

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Corphita

USA . 3,530 parts In-Stock

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3,530

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Microchip USA

USA . 169 parts In-Stock

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169

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Overview

Discover the LM3S5U91-IQC80-A2 by Texas Instruments, a top-of-the-line microcontroller designed for a wide range of applications. With a cutting-edge processor and advanced technology, this product offers unmatched performance and reliability. Whether you're in the automotive industry, consumer electronics, or industrial automation, this microcontroller delivers exceptional value and benefits. Trust in Texas Instruments' reputation for quality and innovation, and take your projects to the next level with the LM3S5U91-IQC80-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability makes the installation of the microcontroller easier and more convenient, especially for automated manufacturing processes.

Maximum Supply Voltage: 1.365 V

Operating at a low maximum supply voltage of 1.365 V can help in reducing power consumption and heat generation, leading to energy efficiency.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing the layout and design of the overall electronic system.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger amounts of data and perform complex calculations more efficiently, suitable for various applications.

Power Supplies (V): 1.3,3.3

Supporting multiple power supply voltages (1.3 V and 3.3 V) provides flexibility in design and compatibility with different components within the system.

No. of Terminals: 100

Having 100 terminals allows for a wide range of connections and interfaces, enabling connectivity with various external devices and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in challenging environmental conditions, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Belonging to the CORTEX-M3 CPU family signifies high-performance capabilities, efficiency, and compatibility with a wide range of software and development tools.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, the microcontroller can operate in cold environments without performance degradation.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

DMA channels facilitate direct memory access, enhancing data transfer speeds and reducing CPU load, improving overall system performance.

ROM Words: 393216

With a large ROM size of 393216 words, the microcontroller can store a significant amount of program code and data, suitable for complex applications.

RAM Bytes: 98304

Having a substantial amount of RAM (98304 bytes) allows for efficient data storage and manipulation, improving the overall processing capabilities of the microcontroller.

Technical Specifications

Microcontrollers LM3S5U91-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5U91-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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