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LM3S5T36-IQR80-C5T

Texas Instruments

LM3S5T36-IQR80-C5T by Texas Instruments

LM3S5T36-IQR80-C5T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 64 terminals, and 12288 bytes of RAM. It operates at up to 50 MHz with PWM and ADC channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,741 parts In-Stock

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4,741

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Vyrian

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 449 parts In-Stock

1+ parts

$8.000

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449

$8.000

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AZTECH Wire

Italy . 816 parts In-Stock

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$9.627

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816

$9.627

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Parana Technologies

USA . 1,669 parts In-Stock

1+ parts

$23.217

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$23.850

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1,669

$23.217

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$23.850

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DigiPath Technology Company

USA . 1,807 parts In-Stock

1+ parts

$25.565

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$23.520

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1,807

$25.565

$23.520

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ChromeModa Solutions

Germany . 4,402 parts In-Stock

1+ parts

$26.087

100+ parts

$21.391

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4,402

$26.087

$21.391

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IDEA Electronic Components Group

UK . 1,577 parts In-Stock

1+ parts

$26.087

100+ parts

$24.783

1k+ parts

$23.478

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1,577

$26.087

$24.783

$23.478

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Corphita

USA . 3,571 parts In-Stock

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3,571

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Microchip USA

USA . 145 parts In-Stock

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145

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Overview

Unlock the potential of your projects with the LM3S5T36-IQR80-C5T microcontroller by Texas Instruments. Built with precision and expertise, this device offers unparalleled reliability and performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller is designed to deliver value and efficiency. Experience the benefits of advanced technology, seamless integration, and ease of use with the LM3S5T36-IQR80-C5T, setting new standards in quality and innovation. Choose Texas Instruments for cutting-edge solutions that elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the microcontroller suitable for various environments.

Surface Mount: YES

Facilitates easy and efficient PCB assembly and installation.

Maximum Supply Voltage: 1.32 V

Allows for safe and stable operation within specified voltage limits.

Package Shape: SQUARE

Efficient use of space on PCB layout.

Bit Size: 32

Offers a high level of data processing capability.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options for flexibility in design and operation.

No. of Terminals: 64

Provides sufficient connectivity for interfacing with other components.

Package Style (Meter): FLATPACK

Enables efficient heat dissipation and compact design.

Minimum Supply Voltage: 1.08 V

Allows for reliable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

CPU Family: CORTEX-M3

Utilizes an advanced processor architecture for high performance.

Minimum Operating Temperature: -40 °C

Ensures operational reliability in harsh cold climates.

Terminal Finish: MATTE TIN

Enhances solderability and ensures reliable electrical connections.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention for improved performance.

Terminal Position: QUAD

Allows for easy and secure mounting on the PCB.

ROM Words: 32768

Provides ample non-volatile memory for program storage.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 10 mm

Compact form factor for integration in small devices or systems.

Maximum Clock Frequency: 50 MHz

Offers high processing speed for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes.

Length: 10 mm

Optimal dimensions for compact board layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral functions for versatile applications.

RAM Bytes: 12288

Sufficient random-access memory for data storage and processing.

Technology: CMOS

Utilizes low-power CMOS technology for energy-efficient operation.

Terminal Form: GULL WING

Secure terminal configuration for reliable connections.

Maximum Supply Current: 129 mA

Operates within specified current limits for safe and stable performance.

Nominal Supply Voltage: 1.2 V

Standard supply voltage for consistent operation.

PWM Channels: YES

Supports pulse-width modulation for controlling motors and other devices.

ROM Programmability: FLASH

Allows for reprogramming of the ROM memory for flexibility in application development.

Terminal Pitch: 0.5 mm

Fine pitch terminals for efficient signal routing and space-saving designs.

Moisture Sensitivity Level (MSL): 3

Suitable for use in environments with moderate humidity levels.

Speed: 80 rpm

Offers fast processing speed for real-time control applications.

No. of I/O Lines: 33

Sufficient input/output lines for versatile interfacing with external devices.

Technical Specifications

Microcontrollers LM3S5T36-IQR80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5T36-IQR80-C5T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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