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LM3S5T36-IQR80-C3

Texas Instruments

LM3S5T36-IQR80-C3 by Texas Instruments

LM3S5T36-IQR80-C3 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a supply voltage b/w 3V to 3.6V. The package style is flatpack with Gull Wing terminals, making it ideal for compact designs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,145 parts In-Stock

1+ parts

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3,145

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Digiode

USA . 2,007 parts In-Stock

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2,007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,175 parts In-Stock

1+ parts

$1.000

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-

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1,175

$1.000

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AZTECH Wire

Italy . 699 parts In-Stock

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$9.106

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699

$9.106

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Parana Technologies

USA . 1,470 parts In-Stock

1+ parts

$46.167

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1,470

$46.167

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DigiPath Technology Company

USA . 1,074 parts In-Stock

1+ parts

$50.836

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1,074

$50.836

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ChromeModa Solutions

Germany . 4,433 parts In-Stock

1+ parts

$51.873

100+ parts

$42.536

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4,433

$51.873

$42.536

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IDEA Electronic Components Group

UK . 1,875 parts In-Stock

1+ parts

$51.873

100+ parts

$49.279

1k+ parts

$46.686

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1,875

$51.873

$49.279

$46.686

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Corphita

USA . 3,539 parts In-Stock

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3,539

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Microchip USA

USA . 195 parts In-Stock

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195

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Overview

Unlock the power of innovation with the LM3S5T36-IQR80-C3 by Texas Instruments, a top-of-the-line microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise by Texas Instruments, this microcontroller boasts unparalleled quality and reliability. Perfect for a wide range of applications, this versatile device offers unmatched value, benefits, and advantages to customers looking to push the boundaries of possibility. Experience the difference with the LM3S5T36-IQR80-C3 and watch your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, making it ideal for long-term use in various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power inputs, offering flexibility in powering options.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy integration into compact designs.

Bit Size: 32

A 32-bit architecture provides high processing power and performance, making this microcontroller suitable for demanding applications.

No. of Terminals: 64

Having 64 terminals enables connectivity with various external components, expanding the functionality of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environments or under heavy loads.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this microcontroller to function effectively in cold conditions without risk of damage.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16 MHz allows for fast data processing and real-time operations, making this microcontroller suitable for time-critical tasks.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software, allowing for easy customization and future-proofing of the microcontroller.

Technical Specifications

Microcontrollers LM3S5T36-IQR80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5T36-IQR80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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