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LM3S5R36-IQR80-C5

Texas Instruments

LM3S5R36-IQR80-C5 by Texas Instruments

LM3S5R36-IQR80-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.348 MHz. It features 49152 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring high-speed processing and multiple I/O lines.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,109 parts In-Stock

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Bristol Electronics

USA . 4,063 parts In-Stock

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4,063

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Digiode

USA . 266 parts In-Stock

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266

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Distributors (Availability)

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$10.755

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414

$10.755

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One Stop Electronics

USA . 1,245 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 1,741 parts In-Stock

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$75.205

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$75.205

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ChromeModa Solutions

Germany . 4,211 parts In-Stock

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$84.500

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$69.290

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4,211

$84.500

$69.290

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IDEA Electronic Components Group

UK . 763 parts In-Stock

1+ parts

$84.500

100+ parts

$80.275

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$76.050

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763

$84.500

$80.275

$76.050

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DigiPath Technology Company

USA . 2,256 parts In-Stock

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$76.185

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Microchip USA

USA . 440 parts In-Stock

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440

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Corphita

USA . 266 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S5R36-IQR80-C5 microcontroller by Texas Instruments. Built with top-notch quality and reliability, this powerful device is perfect for a wide range of applications in industries such as automotive, consumer electronics, and industrial automation. With its cutting-edge technology and versatile features, this microcontroller offers unmatched value, efficiency, and performance to customers looking to take their projects to the next level. Experience innovation like never before with the LM3S5R36-IQR80-C5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration and soldering onto circuit boards, making the assembly process more efficient.

Maximum Supply Voltage: 1.365 V

Operates within a safe voltage range, preventing damage to the microcontroller.

Bit Size: 32

Provides sufficient computational power for various tasks and applications.

Power Supplies (V): 1.3,3.3

Offers flexibility in power options, allowing for compatibility with different power sources.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact and efficient PCB designs, saving space and reducing overall system size.

Minimum Supply Voltage: 1.235 V

Allows for operation at lower voltages, potentially reducing power consumption.

CPU Family: CORTEX-M3

Utilizes a powerful and energy-efficient CPU architecture for optimized performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold conditions, ensuring reliability in harsh environments.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant terminal finish for long-term use.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling interface with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access, enhancing data transfer speed and efficiency.

Terminal Position: QUAD

Quad-terminal configuration offers improved stability and reliability in solder connections.

ROM Words: 262144

Large ROM capacity for storing program code and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim electronic devices.

Width: 10 mm

Compact form factor for space-constrained applications.

Maximum Clock Frequency: 16.348 MHz

High clock frequency for fast and efficient processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper solder reflow process during manufacturing without damaging the microcontroller.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes for soldering.

Length: 10 mm

Compact size for versatile placement and integration into electronic devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings with robust temperature and environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Integrated peripherals for enhanced functionality and connectivity in embedded systems.

RAM Bytes: 49152

Sufficient RAM capacity for data storage and manipulation, facilitating multitasking and complex computations.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals for reliable solder connections and mechanical strength.

Maximum Supply Current: 129 mA

Efficient power consumption with low supply current requirements.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage for consistent and reliable operation.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM for reprogrammability, allowing for easy firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage procedures.

Speed: 80 rpm

Suitable for applications requiring moderate processing speeds.

No. of I/O Lines: 33

Adequate I/O lines for interfacing with external devices and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers LM3S5R36-IQR80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.348 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5R36-IQR80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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