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LM3S5R36-IQR80-C3T

Texas Instruments

LM3S5R36-IQR80-C3T by Texas Instruments

Texas Instruments LM3S5R36-IQR80-C3T is a 32-bit microcontroller with 64 terminals, operating at max 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring FLASH ROM programmability and up to 80 rpm speed control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,177 parts In-Stock

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8,177

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Digiode

USA . 4,957 parts In-Stock

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4,957

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$9.736

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423

$9.736

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One Stop Electronics

USA . 1,112 parts In-Stock

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$30.000

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1,112

$30.000

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Parana Technologies

USA . 1,110 parts In-Stock

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$52.312

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1,110

$52.312

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ChromeModa Solutions

Germany . 3,038 parts In-Stock

1+ parts

$58.778

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$48.198

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3,038

$58.778

$48.198

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

1+ parts

$58.778

100+ parts

$55.839

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$52.900

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2,095

$58.778

$55.839

$52.900

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Corphita

USA . 4,340 parts In-Stock

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4,340

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DigiPath Technology Company

USA . 1,411 parts In-Stock

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$52.994

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$52.994

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Microchip USA

USA . 432 parts In-Stock

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432

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Overview

Enhance your projects with the LM3S5R36-IQR80-C3T microcontroller by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in a compact package. This versatile microcontroller is perfect for a wide range of applications, offering customers reliable performance and efficiency. With features like ADC and DMA channels, PWM capabilities, and ROM programmability, this microcontroller is a must-have for any industrial-grade project. Experience the value and benefits of Texas Instruments with the LM3S5R36-IQR80-C3T microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a variety of power sources, providing flexibility in design.

Bit Size: 32

The 32-bit architecture allows for faster processing speed and higher data throughput.

No. of Terminals: 64

Having a high number of terminals allows for more connectivity options and peripheral integration.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables quick execution of instructions, leading to efficient operation.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where the device may be exposed to higher temperatures and harsh environments.

Technical Specifications

Microcontrollers LM3S5R36-IQR80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5R36-IQR80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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