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LM3S5R36-IQR80-C1

Texas Instruments

LM3S5R36-IQR80-C1 by Texas Instruments

Texas Instruments' LM3S5R36-IQR80-C1 microcontroller features 32-bit architecture, 64 terminals, and operates at a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring ADC and DMA channels, with ROM programmability and PWM support.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,259 parts In-Stock

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Digiode

USA . 2,469 parts In-Stock

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AZTECH Wire

Italy . 553 parts In-Stock

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$6.648

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One Stop Electronics

USA . 788 parts In-Stock

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$19.000

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Parana Technologies

USA . 1,165 parts In-Stock

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$70.673

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$6,563.071

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$63.606

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DigiPath Technology Company

USA . 2,054 parts In-Stock

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IDEA Electronic Components Group

UK . 1,280 parts In-Stock

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$79.408

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$75.438

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$71.467

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ChromeModa Solutions

Germany . 789 parts In-Stock

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$79.408

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$65.115

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QUARKTWIN TECHNOLOGY LTD

USA . 29,542 parts In-Stock

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Microchip USA

USA . 6,321 parts In-Stock

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Corphita

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Overview

Unlock the endless possibilities of innovation with the LM3S5R36-IQR80-C1 microcontroller from Texas Instruments. This cutting-edge device combines top-notch quality and reliability, making it the go-to choice for a wide range of applications. Whether you're looking to enhance your industrial processes or develop the next groundbreaking technology, this microcontroller offers unmatched value, efficiency, and performance. Trust in Texas Instruments to deliver superior products that empower you to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for portable or rugged applications.

Surface Mount: YES

The surface mount capability makes it easy to integrate into compact designs and saves space on PCBs.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power input options, accommodating a wider range of power sources.

Package Shape: SQUARE

The square package shape offers efficient use of board space and uniformity in design layout.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and perform tasks with higher precision and efficiency.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and external components, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style allows for easy mounting on PCBs and efficient heat dissipation, contributing to overall system reliability.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in applications where power consumption is critical.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in industrial environments with varying temperature conditions.

ADC Channels: YES

The inclusion of Analog-to-Digital Converter channels allows for interfacing with analog sensors and signals, expanding the range of applications the microcontroller can support.

DMA Channels: YES

The presence of Direct Memory Access channels enables efficient data transfer and processing, improving overall system performance and throughput.

Terminal Position: QUAD

The quad terminal position layout facilitates easy board placement and routing, simplifying the assembly process.

Maximum Seated Height: 1.6 mm

The low maximum seated height profile makes the microcontroller suitable for space-constrained applications and enables compact device designs.

Width: 10 mm

The compact width dimension allows for versatility in board layouts and integration into various electronic devices.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency enables fast processing speeds and responsiveness, making the microcontroller suitable for demanding real-time applications.

Length: 10 mm

The short length dimension contributes to compact and efficient PCB designs, saving space in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals, it offers a convenient solution for embedded system development and IoT applications.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and mechanical strength, enhancing the durability and reliability of the microcontroller.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage simplifies power management and ensures consistent performance throughout the operational range.

PWM Channels: YES

The availability of Pulse Width Modulation channels allows for precise control of analog outputs, essential for motor control and lighting applications.

ROM Programmability: FLASH

The Flash ROM programmability feature enables firmware updates and customization, making the microcontroller adaptable to evolving project requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and compact PCB designs, enabling the integration of the microcontroller in space-constrained applications.

Speed: 80 rpm

The high speed capability of 80 rpm ensures fast data processing and response times, making the microcontroller suitable for time-critical applications.

No. of I/O Lines: 33

Having 33 I/O lines provides ample input and output options for interfacing with external devices, sensors, and peripherals, enhancing the connectivity and functionality of the microcontroller.

Technical Specifications

Microcontrollers LM3S5R36-IQR80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5R36-IQR80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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