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LM3S5R31-IQC80-C3

Texas Instruments

LM3S5R31-IQC80-C3 by Texas Instruments

LM3S5R31-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing. With a supply voltage range of 3V to 3.6V and compact dimensions (14mm x 14mm), it offers efficient performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Arrow

USA . 21 parts In-Stock

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Vyrian

USA . 7,875 parts In-Stock

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7,875

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Digiode

USA . 1,790 parts In-Stock

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1,790

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AZTECH Wire

Italy . 489 parts In-Stock

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$21.430

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489

$21.430

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Parana Technologies

USA . 1,499 parts In-Stock

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$75.472

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$75.472

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ChromeModa Solutions

Germany . 6,747 parts In-Stock

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$84.800

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$69.536

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$84.800

$69.536

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IDEA Electronic Components Group

UK . 990 parts In-Stock

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$84.800

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$80.560

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$76.320

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990

$84.800

$80.560

$76.320

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QUARKTWIN TECHNOLOGY LTD

USA . 27,653 parts In-Stock

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Lixinc

USA . 7,918 parts In-Stock

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Microchip USA

USA . 7,896 parts In-Stock

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Corphita

USA . 3,421 parts In-Stock

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DigiPath Technology Company

USA . 2,318 parts In-Stock

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$76.456

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2,318

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$76.456

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Overview

Unleash the power of innovation with the LM3S5R31-IQC80-C3 by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-notch quality and reliability in every product. Ideal for a wide range of applications, this microcontroller offers unmatched performance and versatility. With advanced features like ADC and DMA channels, PWM channels, and ROM programmability, this compact device ensures seamless operation at an industrial temperature grade. Elevate your projects with the LM3S5R31-IQC80-C3 - where precision meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing versatility in different applications.

Package Shape: SQUARE

Facilitates easier placement and alignment on the circuit board, optimizing space usage.

Bit Size: 32

Offers a higher processing capability and memory capacity, suitable for complex tasks and applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Ensures a compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Can operate effectively even with lower voltage inputs, increasing compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

Can handle higher temperatures, allowing for reliable operation in challenging environments.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with analog sensors and signals.

DMA Channels: YES

Supports direct memory access, improving data transfer efficiency and overall system performance.

Terminal Position: QUAD

Facilitates easier routing of connections on the circuit board, simplifying the design process.

Maximum Seated Height: 1.6 mm

Low profile design saves space in compact electronic devices.

Width: 14 mm

Compact width allows for easy integration into various electronic systems.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speeds, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time reduces the risk of heat damage during assembly processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures for reliable soldering connections.

Length: 14 mm

Compact length allows for flexible placement in electronic systems.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller with integrated peripherals, suitable for embedded systems.

Technology: CMOS

Low power consumption CMOS technology for efficient operation and longer battery life.

Terminal Form: GULL WING

Gull wing terminals allow for easy and secure soldering in surface mount applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance in various operating conditions.

PWM Channels: YES

Supports pulse width modulation for precise control of output signals.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting and compact design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing processes.

Speed: 80 rpm

Operating at 80 rpm allows for efficient processing of tasks and data handling.

No. of I/O Lines: 67

Ample I/O lines for connecting to external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S5R31-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5R31-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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